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dc.contributor.authorDiaz, Edwin Hernandez
dc.contributor.authorAlfano, Marco
dc.contributor.authorPulungan, Ditho Ardiansyah
dc.contributor.authorLubineau, Gilles
dc.date.accessioned2017-11-29T11:13:56Z
dc.date.available2017-11-29T11:13:56Z
dc.date.issued2017-11-27
dc.identifier.citationHernandez E, Alfano M, Pulungan D, Lubineau G (2017) Toughness amplification in copper/epoxy joints through pulsed laser micro-machined interface heterogeneities. Scientific Reports 7. Available: http://dx.doi.org/10.1038/s41598-017-16471-6.
dc.identifier.issn2045-2322
dc.identifier.pmid29180677
dc.identifier.doi10.1038/s41598-017-16471-6
dc.identifier.urihttp://hdl.handle.net/10754/626246
dc.description.abstractThis work addresses the mechanics of debonding along copper/epoxy joints featuring patterned interfaces. Engineered surface heterogeneities with enhanced adhesion properties are generated through pulsed laser irradiation. Peel tests are carried out to ascertain the effect of patterns shape and area fraction on the mechanical response. Experimental results are evaluated with the support of three-dimensional finite element simulations based on the use of cohesive surfaces. Results discussion is largely framed in terms of effective peel force and energy absorbed to sever the samples. It is shown that surface heterogeneities act as sites of potential crack pinning able to trigger crack initiation, propagation and arrest. Surface patterns ultimately enable a remarkable increase in the effective peel force and dissipated energy with respect to baseline homogeneous sanded interface.
dc.description.sponsorshipThe research reported in this publication was supported by funding from King Abdullah University of Science and Technology (KAUST). We thank KAUST for its continuous support. M.A. acknowledges the financial support received from University of Calabria.
dc.publisherSpringer Nature
dc.relation.urlhttps://www.nature.com/articles/s41598-017-16471-6
dc.rightsThis article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/
dc.titleToughness amplification in copper/epoxy joints through pulsed laser micro-machined interface heterogeneities
dc.typeArticle
dc.contributor.departmentMechanical Engineering Program
dc.contributor.departmentPhysical Sciences and Engineering (PSE) Division
dc.identifier.journalScientific Reports
dc.eprint.versionPublisher's Version/PDF
dc.contributor.institutionDepartment of Mechanical, Energy and Management Engineering (DIMEG), University of Calabria, Via P. Bucci 44C, 87036, Rende, CS, Italy
kaust.personHernandez Diaz, Edwin
kaust.personPulungan, Ditho Ardiansyah
kaust.personLubineau, Gilles
refterms.dateFOA2018-06-13T19:05:23Z
dc.date.published-online2017-11-27
dc.date.published-print2017-12


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This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.
Except where otherwise noted, this item's license is described as This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.