Flexible diodes for radio frequency (RF) electronics: a materials perspective
Georgiadou, Dimitra G
Anthopoulos, Thomas D.
KAUST DepartmentPhysical Sciences and Engineering (PSE) Division
Permanent link to this recordhttp://hdl.handle.net/10754/626064
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AbstractOver the last decade, there has been increasing interest in transferring the research advances in radiofrequency (RF) rectifiers, the quintessential element of the chip in the RF identification (RFID) tags, obtained on rigid substrates onto plastic (flexible) substrates. The growing demand for flexible RFID tags, wireless communications applications and wireless energy harvesting systems that can be produced at a low-cost is a key driver for this technology push. In this topical review, we summarise recent progress and status of flexible RF diodes and rectifying circuits, with specific focus on materials and device processing aspects. To this end, different families of materials (e.g. flexible silicon, metal oxides, organic and carbon nanomaterials), manufacturing processes (e.g. vacuum and solution processing) and device architectures (diodes and transistors) are compared. Although emphasis is placed on performance, functionality, mechanical flexibility and operating stability, the various bottlenecks associated with each technology are also addressed. Finally, we present our outlook on the commercialisation potential and on the positioning of each material class in the RF electronics landscape based on the findings summarised herein. It is beyond doubt that the field of flexible high and ultra-high frequency rectifiers and electronics as a whole will continue to be an active area of research over the coming years.
CitationSemple J, Georgiadou DG, Wyatt-Moon G, Gelinck G, Anthopoulos TD (2017) Flexible diodes for radio frequency (RF) electronics: a materials perspective. Semiconductor Science and Technology 32: 123002. Available: http://dx.doi.org/10.1088/1361-6641/aa89ce.
SponsorsThe authors are grateful to the European Research Council (ERC) AMPRO grant number 280221, the European Union's Horizon 2020 research and innovation programme, under the Marie Skłodowska-Curie grant agreement 706707, and the Engineering and Physical Sciences Research Council (EPSRC) Centre for Innovative Manufacturing in Large Area Electronics (CIM-LAE) grant no. EP/K03099X/1 for financial support.
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