Show simple item record

dc.contributor.authorShaikh, Sohail F.
dc.contributor.authorGhoneim, Mohamed T.
dc.contributor.authorBahabry, Rabab R.
dc.contributor.authorKhan, Sherjeel M.
dc.contributor.authorHussain, Muhammad Mustafa
dc.date.accessioned2017-10-25T08:38:23Z
dc.date.available2017-10-25T08:38:23Z
dc.date.issued2017-10-24
dc.identifier.citationShaikh SF, Ghoneim MT, Bahabry RR, Khan SM, Hussain MM (2017) Modular Lego-Electronics. Advanced Materials Technologies: 1700147. Available: http://dx.doi.org/10.1002/admt.201700147.
dc.identifier.issn2365-709X
dc.identifier.doi10.1002/admt.201700147
dc.identifier.urihttp://hdl.handle.net/10754/625943
dc.description.abstractElectronic system components have thousands of individual field effect transistors (FETs) interconnected executing dedicated functions. Assembly yield of >80% will guarantee system failure since a single interconnect failure will result in undesired performance. Hence, a paradigm shift is needed in the self-assembly or integration of state-of-the-art integrated circuits (ICs) for a physically compliant system. Traditionally, most ICs share same geometry with only variations in dimensions and packaging. Here, a generic manufacturable method of converting state-of-the-art complementary metal oxide semiconductor-based ICs into modular Lego-electronics is shown with unique geometry that is physically identifiable to ease manufacturing and enhance throughput. Various geometries at the backside of the silicon die and on the destination site having the same geometry with relaxed dimension (up to 50 µm extra) allow targeted site binding like DNA assembly. Different geometries, angles, and heights for different modules provide a unique identity to each of the ICs. A two-level geometric combination presented here helps in maintaining the uniqueness of individual module to assemble at exact matching site like a perfect lock-and-key model. The assembled ICs offer uncompromised electrical performance, higher yield, and fabrication ease. In future, this method can further be expanded for fluidic assisted self-assembly.
dc.description.sponsorshipThis publication is based upon work supported by the King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Award No. Sensor Innovation Initiative OSR-2015-Sensors-2707 and KAUST-KFUPM Special Initiative OSR-2016-KKI-2880.
dc.publisherWiley
dc.relation.urlhttp://onlinelibrary.wiley.com/doi/10.1002/admt.201700147/full
dc.rightsThis is the peer reviewed version of the following article: Modular Lego-Electronics, which has been published in final form at http://doi.org/10.1002/admt.201700147. This article may be used for non-commercial purposes in accordance With Wiley Terms and Conditions for self-archiving.
dc.titleModular Lego-Electronics
dc.typeArticle
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentIntegrated Disruptive Electronic Applications (IDEA) Lab
dc.contributor.departmentIntegrated Nanotechnology Lab
dc.contributor.departmentMaterial Science and Engineering Program
dc.contributor.departmentPhysical Science and Engineering (PSE) Division
dc.identifier.journalAdvanced Materials Technologies
dc.eprint.versionPost-print
kaust.personShaikh, Sohail F.
kaust.personGhoneim, Mohamed T.
kaust.personBahabry, Rabab R.
kaust.personKhan, Sherjeel
kaust.personHussain, Muhammad Mustafa
kaust.grant.numberOSR-2015-Sensors-2707
kaust.grant.numberOSR-2016-KKI-2880
refterms.dateFOA2018-10-24T00:00:00Z
dc.date.published-online2017-10-24
dc.date.published-print2018-02


Files in this item

Thumbnail
Name:
admt.201700147_R1.pdf
Size:
2.322Mb
Format:
PDF
Description:
Accepted Manuscript

This item appears in the following Collection(s)

Show simple item record