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    Modular Lego-Electronics

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    admt.201700147_R1.pdf
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    2.322Mb
    Format:
    PDF
    Description:
    Accepted Manuscript
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    Type
    Article
    Authors
    Shaikh, Sohail F. cc
    Ghoneim, Mohamed T. cc
    Bahabry, Rabab R. cc
    Khan, Sherjeel M. cc
    Hussain, Muhammad Mustafa cc
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Integrated Disruptive Electronic Applications (IDEA) Lab
    Integrated Nanotechnology Lab
    Material Science and Engineering Program
    Physical Science and Engineering (PSE) Division
    KAUST Grant Number
    OSR-2015-Sensors-2707
    OSR-2016-KKI-2880
    Date
    2017-10-24
    Online Publication Date
    2017-10-24
    Print Publication Date
    2018-02
    Permanent link to this record
    http://hdl.handle.net/10754/625943
    
    Metadata
    Show full item record
    Abstract
    Electronic system components have thousands of individual field effect transistors (FETs) interconnected executing dedicated functions. Assembly yield of >80% will guarantee system failure since a single interconnect failure will result in undesired performance. Hence, a paradigm shift is needed in the self-assembly or integration of state-of-the-art integrated circuits (ICs) for a physically compliant system. Traditionally, most ICs share same geometry with only variations in dimensions and packaging. Here, a generic manufacturable method of converting state-of-the-art complementary metal oxide semiconductor-based ICs into modular Lego-electronics is shown with unique geometry that is physically identifiable to ease manufacturing and enhance throughput. Various geometries at the backside of the silicon die and on the destination site having the same geometry with relaxed dimension (up to 50 µm extra) allow targeted site binding like DNA assembly. Different geometries, angles, and heights for different modules provide a unique identity to each of the ICs. A two-level geometric combination presented here helps in maintaining the uniqueness of individual module to assemble at exact matching site like a perfect lock-and-key model. The assembled ICs offer uncompromised electrical performance, higher yield, and fabrication ease. In future, this method can further be expanded for fluidic assisted self-assembly.
    Citation
    Shaikh SF, Ghoneim MT, Bahabry RR, Khan SM, Hussain MM (2017) Modular Lego-Electronics. Advanced Materials Technologies: 1700147. Available: http://dx.doi.org/10.1002/admt.201700147.
    Sponsors
    This publication is based upon work supported by the King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Award No. Sensor Innovation Initiative OSR-2015-Sensors-2707 and KAUST-KFUPM Special Initiative OSR-2016-KKI-2880.
    Publisher
    Wiley
    Journal
    Advanced Materials Technologies
    DOI
    10.1002/admt.201700147
    Additional Links
    http://onlinelibrary.wiley.com/doi/10.1002/admt.201700147/full
    ae974a485f413a2113503eed53cd6c53
    10.1002/admt.201700147
    Scopus Count
    Collections
    Articles; Physical Science and Engineering (PSE) Division; Electrical and Computer Engineering Program; Material Science and Engineering Program; Integrated Nanotechnology Lab; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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