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dc.contributor.authorHussain, Muhammad Mustafa
dc.contributor.authorTorres Sevilla, Galo Andres
dc.contributor.authorDiaz Cordero, Marlon Steven
dc.date.accessioned2017-10-16T12:29:54Z
dc.date.available2017-10-16T12:29:54Z
dc.date.issued2017-09-08
dc.date.submitted2016-02-29
dc.identifier.urihttp://hdl.handle.net/10754/625861
dc.description.abstractElectronic stickers may be manufactured on flexible substrates (110, 120, 130) as layers and packaged together. The package may then have an adhesive applied to one side to provide capability for sticking the electronic devices to surfaces. The stickers can be wrappable, placed on surfaces, glued on walls or mirrors or wood or stone, and have electronics (112, 122, 132) which may or may not be ultrathin. Packaging for the electronic sticker can use polymer on cellulose manufacturing and/or three dimensional (3-D) printing. The electronic stickers may provide lighting capability, sensing capability, and/or recharging capabilities.
dc.relation.urlhttp://www.google.com/patents/WO2017149455A1
dc.relation.urlhttp://worldwide.espacenet.com/publicationDetails/biblio?CC=WO&NR=2017149455A1&KC=A1&FT=D
dc.titleSticker electronics
dc.typePatent
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.description.statusPublished Application
dc.contributor.assigneeKing Abdullah University Of Science And Technology
dc.description.countryWorld Intellectual Property Organization (WIPO)
dc.identifier.applicationnumberWO 2017149455 A1
refterms.dateFOA2018-06-13T19:18:31Z


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