Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method
| dc.contributor.author | Zhang, Xuan | |
| dc.contributor.author | Zheng, Xiujun | |
| dc.contributor.author | Zhang, Hong | |
| dc.contributor.author | Zhang, Junli | |
| dc.contributor.author | Fu, Jiecai | |
| dc.contributor.author | Zhang, Qiang | |
| dc.contributor.author | Peng, Chaoyi | |
| dc.contributor.author | Bai, Feiming | |
| dc.contributor.author | Zhang, Xixiang | |
| dc.contributor.author | Peng, Yong | |
| dc.date.accessioned | 2017-08-17T06:37:53Z | |
| dc.date.available | 2017-08-17T06:37:53Z | |
| dc.date.issued | 2017 | |
| dc.identifier.citation | Zhang X, Zheng X, Zhang H, Zhang J, Fu J, et al. (2017) Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method. J Mater Chem C. Available: http://dx.doi.org/10.1039/c7tc01668a. | |
| dc.identifier.issn | 2050-7526 | |
| dc.identifier.issn | 2050-7534 | |
| dc.identifier.doi | 10.1039/c7tc01668a | |
| dc.identifier.uri | http://hdl.handle.net/10754/625352 | |
| dc.description.abstract | Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion. | |
| dc.description.sponsorship | This work was supported by National Natural Science Foundation of China (51571104 and 11274145), MOST International Cooperation Funds (2014DFA91340), Program for Changjiang Scholars and Innovative Research Team in the University (Grant No. IRT1251). | |
| dc.publisher | Royal Society of Chemistry (RSC) | |
| dc.relation.url | http://pubs.rsc.org/en/Content/ArticleLanding/2017/TC/C7TC01668A#!divAbstract | |
| dc.rights | Archived with thanks to J. Mater. Chem. C | |
| dc.title | Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method | |
| dc.type | Article | |
| dc.contributor.department | Imaging and Characterization Core Lab | |
| dc.contributor.department | Material Science and Engineering Program | |
| dc.contributor.department | Nanofabrication Core Lab | |
| dc.contributor.department | Physical Science and Engineering (PSE) Division | |
| dc.contributor.department | Thin Films & Characterization | |
| dc.identifier.journal | J. Mater. Chem. C | |
| dc.eprint.version | Post-print | |
| dc.contributor.institution | Key Laboratory of Magnetism and Magnetic Materials of Ministry of Education, School of Physical Science and Technology, Lanzhou University, Lanzhou 730000, Gansu | |
| dc.contributor.institution | State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology, Chengdu 610054, P. R. China | |
| kaust.person | Zhang, Qiang | |
| kaust.person | Zhang, Xixiang | |
| refterms.dateFOA | 2018-08-10T00:00:00Z |
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