Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method
Type
ArticleAuthors
Zhang, XuanZheng, Xiujun
Zhang, Hong
Zhang, Junli
Fu, Jiecai
Zhang, Qiang
Peng, Chaoyi
Bai, Feiming
Zhang, Xixiang
Peng, Yong
KAUST Department
Imaging and Characterization Core LabMaterials Science and Engineering Program
Nanofabrication Core Lab
Physical Sciences and Engineering (PSE) Division
Thin Films & Characterization
Date
2017-08-10Permanent link to this record
http://hdl.handle.net/10754/625352Metadata
Show full item recordAbstract
Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.Citation
Zhang X, Zheng X, Zhang H, Zhang J, Fu J, et al. (2017) Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method. J Mater Chem C. Available: http://dx.doi.org/10.1039/c7tc01668a.Sponsors
This work was supported by National Natural Science Foundation of China (51571104 and 11274145), MOST International Cooperation Funds (2014DFA91340), Program for Changjiang Scholars and Innovative Research Team in the University (Grant No. IRT1251).Publisher
Royal Society of Chemistry (RSC)Journal
J. Mater. Chem. CISSN
2050-75262050-7534
Scopus Count
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