Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method
KAUST DepartmentImaging and Characterization Core Lab
Materials Science and Engineering Program
Nanofabrication Core Lab
Physical Sciences and Engineering (PSE) Division
Thin Films & Characterization
Permanent link to this recordhttp://hdl.handle.net/10754/625352
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AbstractHere we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.
CitationZhang X, Zheng X, Zhang H, Zhang J, Fu J, et al. (2017) Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method. J Mater Chem C. Available: http://dx.doi.org/10.1039/c7tc01668a.
SponsorsThis work was supported by National Natural Science Foundation of China (51571104 and 11274145), MOST International Cooperation Funds (2014DFA91340), Program for Changjiang Scholars and Innovative Research Team in the University (Grant No. IRT1251).
PublisherRoyal Society of Chemistry (RSC)
JournalJ. Mater. Chem. C
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