Low-Cost Energy-Efficient 3-D Nano-Spikes-Based Electric Cell Lysis Chips

Type
Article

Authors
Riaz, Kashif
Leung, Siu
Fan, Zhiyong
Lee, Yi-Kuen

KAUST Department
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division

Online Publication Date
2017-05-04

Print Publication Date
2017-08

Date
2017-05-04

Abstract
Electric cell lysis (ECL) is a promising technique to be integrated with portable lab-on-a-chip without lysing agent due to its simplicity and fast processing. ECL is usually limited by the requirements of high power/voltage and costly fabrication. In this paper, we present low-cost 3-D nano-spikes-based ECL (NSP-ECL) chips for efficient cell lysis at low power consumption. Highly ordered High-Aspect-Ratio (HAR). NSP arrays with controllable dimensions were fabricated on commercial aluminum foils through scalable and electrochemical anodization and etching. The optimized multiple pulse protocols with minimized undesirable electrochemical reactions (gas and bubble generation), common on micro parallel-plate ECL chips. Due to the scalability of fabrication process, 3-D NSPs were fabricated on small chips as well as on 4-in wafers. Phase diagram was constructed by defining critical electric field to induce cell lysis and for cell lysis saturation Esat to define non-ECL and ECL regions for different pulse parameters. NSP-ECL chips have achieved excellent cell lysis efficiencies ηlysis (ca 100%) at low applied voltages (2 V), 2~3 orders of magnitude lower than that of conventional systems. The energy consumption of NSP-ECL chips was 0.5-2 mJ/mL, 3~9 orders of magnitude lower as compared with the other methods (5J/mL-540kJ/mL). [2016-0305]

Citation
Riaz K, Leung S-F, Fan Z, Lee Y-K (2017) Low-Cost Energy-Efficient 3-D Nano-Spikes-Based Electric Cell Lysis Chips. Journal of Microelectromechanical Systems: 1–11. Available: http://dx.doi.org/10.1109/jmems.2017.2695639.

Acknowledgements
Hong Kong Research Grants Council[16237816, 16205314]

Publisher
Institute of Electrical and Electronics Engineers (IEEE)

Journal
Journal of Microelectromechanical Systems

DOI
10.1109/jmems.2017.2695639

Additional Links
http://ieeexplore.ieee.org/document/7919169/

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