Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems
AuthorsSevilla, Galo T.
Nassar, Joanna M.
Kutbee, Arwa T.
Carreno, Armando Arpys Arevalo
Hussain, Muhammad Mustafa
KAUST DepartmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Electromechanical Microsystems & Polymer Integration Research Lab (EMPIRe)
Integrated Disruptive Electronic Applications (IDEA) Lab
Integrated Nanotechnology Lab
Materials Science and Engineering Program
Mechanical Engineering Program
KAUST Grant NumberBAS/1/1619-01-01
Online Publication Date2016-10-13
Print Publication Date2017-01
Permanent link to this recordhttp://hdl.handle.net/10754/623817
MetadataShow full item record
AbstractHigh-performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll-to-roll fashion for highly manufacturable printed flexible high-performance electronic systems.
CitationSevilla GAT, Cordero MD, Nassar JM, Hanna AN, Kutbee AT, et al. (2016) Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems. Advanced Materials Technologies 2: 1600175. Available: http://dx.doi.org/10.1002/admt.201600175.
SponsorsThis publication was based upon work supported by the King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Award No. BAS/1/1619-01-01. The authors are deeply grateful to Prof. Sigurdur T. Thoroddsen for the 3D printing resources made available to the authors in his High Speed Imaging Lab of KAUST. The authors also thank Seneca J. Velling, Visiting Undergradaute Research Intern from the University of Waterloo for proof reading the manuscript.
JournalAdvanced Materials Technologies