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    Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method

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    Type
    Article
    Authors
    Li, Ping
    Dong, Yilin
    Tang, Min
    Mao, Junfa
    Jiang, Li Jun
    Bagci, Hakan cc
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Department of Electronic Engineering, King Abdullah University of Science and Technology, Thuwal 23955, Saudi Arabia.
    Date
    2017-03-11
    Online Publication Date
    2017-03-11
    Print Publication Date
    2017-06
    Permanent link to this record
    http://hdl.handle.net/10754/623216
    
    Metadata
    Show full item record
    Abstract
    Since accurate thermal analysis plays a critical role in the thermal design and management of the 3-D system-level integration, in this paper, a discontinuous Galerkin time-domain (DGTD) algorithm is proposed to achieve this purpose. Such as the parabolic partial differential equation (PDE), the transient thermal equation cannot be directly solved by the DGTD method. To address this issue, the heat flux, as an auxiliary variable, is introduced to reduce the Laplace operator to a divergence operator. The resulting PDE is hyperbolic, which can be further written into a conservative form. By properly choosing the definition of the numerical flux used for the information exchange between neighboring elements, the hyperbolic thermal PDE can be solved by the DGTD together with the auxiliary differential equation. The proposed algorithm is a kind of element-level domain decomposition method, which is suitable to deal with multiscale geometries in 3-D integrated systems. To verify the accuracy and robustness of the developed DGTD algorithm, several representative examples are benchmarked.
    Citation
    Li P, Dong Y, Tang M, Mao J, Jiang LJ, et al. (2017) Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method. IEEE Transactions on Components, Packaging and Manufacturing Technology: 1–10. Available: http://dx.doi.org/10.1109/TCPMT.2017.2666259.
    Sponsors
    This work was supported in part by the National Science Foundation of China under Grant 61234001 and Grant 61674105 and in part by the University Grants Council of Hong Kong under Contract AoE/P-04/08. Recommended for publication by Associate Editor
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Journal
    IEEE Transactions on Components, Packaging and Manufacturing Technology
    DOI
    10.1109/TCPMT.2017.2666259
    Additional Links
    http://ieeexplore.ieee.org/document/7875407/
    ae974a485f413a2113503eed53cd6c53
    10.1109/TCPMT.2017.2666259
    Scopus Count
    Collections
    Articles; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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