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dc.contributor.authorCavazos Sepulveda, Adrian
dc.contributor.authorDiaz Cordero, M. S.
dc.contributor.authorCarreno, Armando Arpys Arevalo
dc.contributor.authorNassar, Joanna M.
dc.contributor.authorHussain, Muhammad Mustafa
dc.date.accessioned2017-04-10T07:49:52Z
dc.date.available2017-04-10T07:49:52Z
dc.date.issued2017-03-30
dc.identifier.citationCavazos Sepulveda AC, Diaz Cordero MS, Carreño AAA, Nassar JM, Hussain MM (2017) Stretchable and foldable silicon-based electronics. Applied Physics Letters 110: 134103. Available: http://dx.doi.org/10.1063/1.4979545.
dc.identifier.issn0003-6951
dc.identifier.issn1077-3118
dc.identifier.doi10.1063/1.4979545
dc.identifier.urihttp://hdl.handle.net/10754/623109
dc.description.abstractFlexible and stretchable semiconducting substrates provide the foundation for novel electronic applications. Usually, ultra-thin, flexible but often fragile substrates are used in such applications. Here, we describe flexible, stretchable, and foldable 500-μm-thick bulk mono-crystalline silicon (100) “islands” that are interconnected via extremely compliant 30-μm-thick connectors made of silicon. The thick mono-crystalline segments create a stand-alone silicon array that is capable of bending to a radius of 130 μm. The bending radius of the array does not depend on the overall substrate thickness because the ultra-flexible silicon connectors are patterned. We use fracture propagation to release the islands. Because they allow for three-dimensional monolithic stacking of integrated circuits or other electronics without any through-silicon vias, our mono-crystalline islands can be used as a “more-than-Moore” strategy and to develop wearable electronics that are sufficiently robust to be compatible with flip-chip bonding.
dc.description.sponsorshipThe research reported in this publication was supported by the King Abdullah University of Science and Technology (KAUST). We also thank Virginia A. Unkefer for helping with the literature.
dc.publisherAIP Publishing
dc.relation.urlhttp://aip.scitation.org/doi/10.1063/1.4979545
dc.rightsThis article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. The following article appeared in Applied Physics Letters and may be found at http://doi.org/10.1063/1.4979545.
dc.titleStretchable and foldable silicon-based electronics
dc.typeArticle
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentIntegrated Disruptive Electronic Applications (IDEA) Lab
dc.contributor.departmentIntegrated Nanotechnology Lab
dc.contributor.departmentMaterial Science and Engineering Program
dc.contributor.departmentMechanical Engineering Program
dc.contributor.departmentPhysical Science and Engineering (PSE) Division
dc.identifier.journalApplied Physics Letters
dc.eprint.versionPublisher's Version/PDF
kaust.personCavazos Sepulveda, Adrian Cesar
kaust.personDiaz Cordero, M. S.
kaust.personCarreno, Armando Arpys Arevalo
kaust.personNassar, Joanna M.
kaust.personHussain, Muhammad Mustafa
refterms.dateFOA2018-03-30T00:00:00Z
dc.date.published-online2017-03-30
dc.date.published-print2017-03-27


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