AuthorsCavazos Sepulveda, Adrian Cesar
Diaz Cordero, M. S.
Carreno, Armando Arpys Arevalo
Nassar, Joanna M.
Hussain, Muhammad Mustafa
KAUST DepartmentIntegrated Disruptive Electronic Applications (IDEA) Lab
Integrated Nanotechnology Lab
Materials Science and Engineering Program
Physical Sciences and Engineering (PSE) Division
Mechanical Engineering Program
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Permanent link to this recordhttp://hdl.handle.net/10754/623109
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AbstractFlexible and stretchable semiconducting substrates provide the foundation for novel electronic applications. Usually, ultra-thin, flexible but often fragile substrates are used in such applications. Here, we describe flexible, stretchable, and foldable 500-μm-thick bulk mono-crystalline silicon (100) “islands” that are interconnected via extremely compliant 30-μm-thick connectors made of silicon. The thick mono-crystalline segments create a stand-alone silicon array that is capable of bending to a radius of 130 μm. The bending radius of the array does not depend on the overall substrate thickness because the ultra-flexible silicon connectors are patterned. We use fracture propagation to release the islands. Because they allow for three-dimensional monolithic stacking of integrated circuits or other electronics without any through-silicon vias, our mono-crystalline islands can be used as a “more-than-Moore” strategy and to develop wearable electronics that are sufficiently robust to be compatible with flip-chip bonding.
CitationCavazos Sepulveda AC, Diaz Cordero MS, Carreño AAA, Nassar JM, Hussain MM (2017) Stretchable and foldable silicon-based electronics. Applied Physics Letters 110: 134103. Available: http://dx.doi.org/10.1063/1.4979545.
SponsorsThe research reported in this publication was supported by the King Abdullah University of Science and Technology (KAUST). We also thank Virginia A. Unkefer for helping with the literature.
JournalApplied Physics Letters