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    Stretchable and foldable silicon-based electronics

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    Type
    Article
    Authors
    Cavazos Sepulveda, Adrian cc
    Diaz Cordero, M. S.
    Carreno, Armando Arpys Arevalo cc
    Nassar, Joanna M. cc
    Hussain, Muhammad Mustafa cc
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Integrated Disruptive Electronic Applications (IDEA) Lab
    Integrated Nanotechnology Lab
    Material Science and Engineering Program
    Mechanical Engineering Program
    Physical Science and Engineering (PSE) Division
    Date
    2017-03-30
    Online Publication Date
    2017-03-30
    Print Publication Date
    2017-03-27
    Permanent link to this record
    http://hdl.handle.net/10754/623109
    
    Metadata
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    Abstract
    Flexible and stretchable semiconducting substrates provide the foundation for novel electronic applications. Usually, ultra-thin, flexible but often fragile substrates are used in such applications. Here, we describe flexible, stretchable, and foldable 500-μm-thick bulk mono-crystalline silicon (100) “islands” that are interconnected via extremely compliant 30-μm-thick connectors made of silicon. The thick mono-crystalline segments create a stand-alone silicon array that is capable of bending to a radius of 130 μm. The bending radius of the array does not depend on the overall substrate thickness because the ultra-flexible silicon connectors are patterned. We use fracture propagation to release the islands. Because they allow for three-dimensional monolithic stacking of integrated circuits or other electronics without any through-silicon vias, our mono-crystalline islands can be used as a “more-than-Moore” strategy and to develop wearable electronics that are sufficiently robust to be compatible with flip-chip bonding.
    Citation
    Cavazos Sepulveda AC, Diaz Cordero MS, Carreño AAA, Nassar JM, Hussain MM (2017) Stretchable and foldable silicon-based electronics. Applied Physics Letters 110: 134103. Available: http://dx.doi.org/10.1063/1.4979545.
    Sponsors
    The research reported in this publication was supported by the King Abdullah University of Science and Technology (KAUST). We also thank Virginia A. Unkefer for helping with the literature.
    Publisher
    AIP Publishing
    Journal
    Applied Physics Letters
    DOI
    10.1063/1.4979545
    Additional Links
    http://aip.scitation.org/doi/10.1063/1.4979545
    ae974a485f413a2113503eed53cd6c53
    10.1063/1.4979545
    Scopus Count
    Collections
    Articles; Physical Science and Engineering (PSE) Division; Electrical and Computer Engineering Program; Material Science and Engineering Program; Mechanical Engineering Program; Integrated Nanotechnology Lab; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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