Freeform Compliant CMOS Electronic Systems for Internet of Everything Applications
AuthorsShaikh, Sohail F.
Ghoneim, Mohamed T.
Sevilla, Galo T.
Nassar, Joanna M.
Hussain, Aftab M.
Hussain, Muhammad Mustafa
KAUST DepartmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Integrated Disruptive Electronic Applications (IDEA) Lab
Integrated Nanotechnology Lab
KAUST Grant NumberBAS/1/1619-01-01
Permanent link to this recordhttp://hdl.handle.net/10754/622746
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AbstractThe state-of-the-art electronics technology has been an integral part of modern advances. The prevalent rise of the mobile device and computational technology in the age of information technology offers exciting applications that are attributed to sophisticated, enormously reliable, and most mature CMOS-based electronics. We are accustomed to high performance, cost-effective, multifunctional, and energy-efficient scaled electronics. However, they are rigid, bulky, and brittle. The convolution of flexibility and stretchability in electronics for emerging Internet of Everything application can unleash smart application horizon in unexplored areas, such as robotics, healthcare, smart cities, transport, and entertainment systems. While flexible and stretchable device themes are being remarkably chased, the realization of the fully compliant electronic system is unaddressed. Integration of data processing, storage, communication, and energy management devices complements a compliant system. Here, a comprehensive review is presented on necessity and design criteria for freeform (physically flexible and stretchable) compliant high-performance CMOS electronic systems.
CitationShaikh SF, Ghoneim MT, Torres Sevilla GA, Nassar JM, Hussain AM, et al. (2017) Freeform Compliant CMOS Electronic Systems for Internet of Everything Applications. IEEE Transactions on Electron Devices: 1–12. Available: http://dx.doi.org/10.1109/TED.2016.2642340.
SponsorsThis work was supported by the King Abdullah University of Science and Technology under Award BAS/1/1619-01-01. The review of this paper was arranged by Editor Y.-Y. Noh.