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Type
ArticleAuthors
Coluccio, Maria LauraAlabastri, Alessandro
Bonanni, Simon
Majewska, Roksana
Dattoli, Elisabetta
Barberio, Marianna
Candeloro, Patrizio

Perozziello, Gerardo
Mollace, Vincenzo
Di Fabrizio, Enzo M.

Gentile, Francesco
KAUST Department
Material Science and Engineering ProgramPhysical Science and Engineering (PSE) Division
Date
2017-01-13Online Publication Date
2017-01-13Print Publication Date
2017-04Permanent link to this record
http://hdl.handle.net/10754/622694
Metadata
Show full item recordAbstract
We used electroless deposition to fabricate clusters of silver nanoparticles (NPs) on a silicon substrate. These clusters are plasmonics devices that induce giant electromagnetic (EM) field increments. When those EM field are absorbed by the metal NPs clusters generate, in turn, severe temperature increases. Here, we used the laser radiation of a conventional Raman set-up to transfer geometrical patterns from a template of metal NPs clusters into a layer of thermo sensitive Polyphthalaldehyde (PPA) polymer. Temperature profile on the devices depends on specific arrangements of silver nanoparticles. In plane temperature variations may be controlled with (i) high nano-meter spatial precision and (ii) single Kelvin temperature resolution on varying the shape, size and spacing of metal nanostructures. This scheme can be used to generate strongly localized heat amplifications for applications in nanotechnology, surface enhanced thermo-lithography (SETL), biology and medicine (for space resolved cell ablation and treatment), nano-chemistry.Citation
Coluccio ML, Alabastri A, Bonanni S, Majewska R, Dattoli E, et al. (2017) Surface enhanced thermo lithography. Microelectronic Engineering. Available: http://dx.doi.org/10.1016/j.mee.2017.01.004.Sponsors
This work has been partially funded from the Ministry of Health, Italy (Project n. GR-201s0-2320665).Publisher
Elsevier BVJournal
Microelectronic EngineeringAdditional Links
http://www.sciencedirect.com/science/article/pii/S0167931717300047ae974a485f413a2113503eed53cd6c53
10.1016/j.mee.2017.01.004