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dc.contributor.authorKim, Sangkil
dc.contributor.authorShamim, Atif
dc.contributor.authorGeorgiadis, Apostolos
dc.contributor.authorAubert, Herve
dc.contributor.authorTentzeris, Manos M.
dc.date.accessioned2017-01-02T09:55:29Z
dc.date.available2017-01-02T09:55:29Z
dc.date.issued2016-02-11
dc.identifier.citationKim S, Shamim A, Georgiadis A, Aubert H, Tentzeris MM (2016) Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates. IEEE Transactions on Components, Packaging and Manufacturing Technology 6: 486–496. Available: http://dx.doi.org/10.1109/TCPMT.2016.2522461.
dc.identifier.issn2156-3950
dc.identifier.issn2156-3985
dc.identifier.doi10.1109/TCPMT.2016.2522461
dc.identifier.urihttp://hdl.handle.net/10754/622546
dc.description.abstractIn this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of ∼ 0.2~ Ω . An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.
dc.description.sponsorshipThe work of S. Kim and M. Tentzeris was supported by NSF and DTRA. The work of A. Georgiadis has been supported by the EU COST Action IC1301 WiPE Wireless Power Transmission for Sustainable Electronics, the Generalitat de Catalunya under Grant 2014 SGR 1551 and by EU H2020 Marie Sklodowska-Curie grant agreement No 661621. Recommended for publication by Associate Editor A. Shapiro upon evaluation of reviewers' comments.
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.relation.urlhttp://ieeexplore.ieee.org/document/7405313
dc.subjectAdditive fabrication
dc.subjectinkjet-printed substrate-integrated waveguide (SIW)
dc.subjectinkjet-printed via
dc.subjectlow-cost via fabrication
dc.subjectpolymethyl methacrylate (PMMA).
dc.titleFabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates
dc.typeArticle
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.identifier.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.contributor.institutionQualcomm, San Diego, CA, 92121, United States
dc.contributor.institutionCentre Tecnologic de Telecomunicacions de Catalunya, Barcelona, 08860, Spain
dc.contributor.institutionLaboratory for the Analysis and Architecture of Systems, Natl. Ctr. for Scientific Research, Micro and Nanosystems for Wireless Communications Research Group, Toulouse, 31400, France
dc.contributor.institutionSchool of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, 30332, United States
kaust.personShamim, Atif
dc.date.published-online2016-02-11
dc.date.published-print2016-03


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