Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates
KAUST DepartmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Permanent link to this recordhttp://hdl.handle.net/10754/622546
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AbstractIn this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of ∼ 0.2~ Ω . An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.
CitationKim S, Shamim A, Georgiadis A, Aubert H, Tentzeris MM (2016) Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates. IEEE Transactions on Components, Packaging and Manufacturing Technology 6: 486–496. Available: http://dx.doi.org/10.1109/TCPMT.2016.2522461.
SponsorsThe work of S. Kim and M. Tentzeris was supported by NSF and DTRA. The work of A. Georgiadis has been supported by the EU COST Action IC1301 WiPE Wireless Power Transmission for Sustainable Electronics, the Generalitat de Catalunya under Grant 2014 SGR 1551 and by EU H2020 Marie Sklodowska-Curie grant agreement No 661621. Recommended for publication by Associate Editor A. Shapiro upon evaluation of reviewers' comments.