AuthorsCarreno, Armando Arpys Arevalo
Conchouso Gonzalez, David
Foulds, Ian G.
KAUST DepartmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Mechanical Engineering Program
Physical Sciences and Engineering (PSE) Division
Permanent link to this recordhttp://hdl.handle.net/10754/622534
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AbstractIn this paper we present the fabrication and characterization of an array of electrostatic acoustic transducers. The array is micromachined on a silicon wafer using standard micro-machining techniques. Each array contains 2n electrostatic transducer membranes, where “n” is the bit number. Every element of the array has a hexagonal membrane shape structure, which is separated from the substrate by 3µm air gap. The membrane is made out 5µm thick polyimide layer that has a bottom gold electrode on the substrate and a gold top electrode on top of the membrane (250nm). The wafer layout design was diced in nine chips with different array configurations, with variation of the membrane dimensions. The device was tested with 90 V giving and sound output level as high as 35dB, while actuating all the elements at the same time.
CitationArevalo A, Castro D, Conchouso D, Kosel J, Foulds IG (2016) Digital electrostatic acoustic transducer array. 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). Available: http://dx.doi.org/10.1109/NEMS.2016.7758238.
Journal2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)