KAUST DepartmentPhysical Sciences and Engineering (PSE) Division
Permanent link to this recordhttp://hdl.handle.net/10754/622354
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AbstractDirect magnetron sputtering of transition metal dichalcogenide targets is proposed as a new approach for depositing large-area two-dimensional layered materials. Bilayer to few-layer MoS2 deposited by magnetron sputtering followed by post-deposition annealing shows superior area scalability over 20 cm(2) and layer-by-layer controllability. High crystallinity of layered MoS2 was confirmed by Raman, photo-luminescence, and transmission electron microscopy analysis. The sputtering temperature and annealing ambience were found to play an important role in the film quality. The top-gate field-effect transistor by using the layered MoS2 channel shows typical n-type characteristics with a current on/off ratio of approximately 10(4). The relatively low mobility is attributed to the small grain size of 0.1-1 mu m with a trap charge density in grain boundaries of the order of 10(13) cm(-2).
CitationHuang J-H, Chen H-H, Liu P-S, Lu L-S, Wu C-T, et al. (2016) Large-area few-layer MoS 2 deposited by sputtering . Materials Research Express 3: 065007. Available: http://dx.doi.org/10.1088/2053-1591/3/6/065007.
SponsorsThis work was supported by Ministry of Science and Technology of Taiwan, Republic of China, under grant MOST103-2221-E-009-221-MY3 and 102-2119-M-001-005-MY3, and by NCTU-UCB I-RiCE program, under grant MOST104-2911-I-009-301. The authors are grateful to the Nano Facility Center at National Chiao Tung University and National Nano Device Laboratories, where the experiments in this paper were performed.
JournalMaterials Research Express