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    Single-phase liquid flow forced convection under a nearly uniform heat flux boundary condition in microchannels

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    Type
    Article
    Authors
    Lee, Man
    Lee, Yi-Kuen cc
    Zohar, Yitshak
    KAUST Grant Number
    SA-C0040/UK-C0016
    Date
    2012-02-22
    Online Publication Date
    2012-02-22
    Print Publication Date
    2012-03-01
    Permanent link to this record
    http://hdl.handle.net/10754/599638
    
    Metadata
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    Abstract
    A microchannel heat sink, integrated with pressure and temperature microsensors, is utilized to study single-phase liquid flow forced convection under a uniform heat flux boundary condition. Utilizing a waferbond-and-etch- back technology, the heat source, temperature and pressure sensors are encapsulated in a thin composite membrane capping the microchannels, thus allowing experimentally good control of the thermal boundary conditions. A three-dimensional physical model has been constructed to facilitate numerical simulations of the heat flux distribution. The results indicate that upstream the cold working fluid absorbs heat, while, within the current operating conditions, downstream the warmer working fluid releases heat. The Nusselt number is computed numerically and compared with experimental and analytical results. The wall Nusselt number in a microchannel can be estimated using classical analytical solutions only over a limited range of the Reynolds number, Re: both the top and bottom Nusselt numbers approach 4 for Re < 1, while the top and bottom Nusselt numbers approach 0 and 5.3, respectively, for Re > 100. The experimentally estimated Nusselt number for forced convection is highly sensitive to the location of the temperature measurements used in calculating the Nusselt number. © 2012 IOP Publishing Ltd.
    Citation
    Lee M, Lee Y-K, Zohar Y (2012) Single-phase liquid flow forced convection under a nearly uniform heat flux boundary condition in microchannels. Journal of Micromechanics and Microengineering 22: 035015. Available: http://dx.doi.org/10.1088/0960-1317/22/3/035015.
    Sponsors
    This work is supported by a grant from Hong Kong Research Grants Council (Grant No 616106) and partially supported by a grant from King Abdullah University of Science and Technology (KAUST Award No SA-C0040/UK-C0016).
    Publisher
    IOP Publishing
    Journal
    Journal of Micromechanics and Microengineering
    DOI
    10.1088/0960-1317/22/3/035015
    ae974a485f413a2113503eed53cd6c53
    10.1088/0960-1317/22/3/035015
    Scopus Count
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