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    Large area crystallization of amorphous Si with overlapping high repetition rate laser pulses

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    Type
    Article
    Authors
    Ryu, Sang-Gil
    Gruber, Ivan
    Grigoropoulos, Costas P.
    Poulikakos, Dimos
    Moon, Seung-Jae
    Date
    2012-09
    Permanent link to this record
    http://hdl.handle.net/10754/598694
    
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    Abstract
    This paper presents a pulsed laser crystallization technique, enabling large area crystallization of amorphous Si to produce grains having well-defined size and orientation. The method is developed by first determining the parameters influencing crystallization induced by single laser pulses of circular cross-sectional profile. In a second step, crystallization by overlapping round spots is examined. The experiments reveal three zones characterized by distinctly different crystallized morphologies following the laser irradiation. One of these zones corresponds to the regime of lateral crystal growth, wherein grains are driven towards the center of the spot by the radial temperature gradient. These findings are then applied to processing via line beam profiles that facilitate large area crystallization upon rapid translation of the specimen. Crystallization of extended areas hinges on the determination of the crystal growth length for a single spot. The pitch between successive pulses is then set on the basis of this information. It is shown that the pulse energy has only a weak effect on the crystal growth length. © 2012 Elsevier B.V.
    Citation
    Ryu S-G, Gruber I, Grigoropoulos CP, Poulikakos D, Moon S-J (2012) Large area crystallization of amorphous Si with overlapping high repetition rate laser pulses. Thin Solid Films 520: 6724–6729. Available: http://dx.doi.org/10.1016/j.tsf.2012.07.052.
    Sponsors
    This work was supported by a grant to CPG by the King Abdullah University of Science and Technology (KAUST).
    Publisher
    Elsevier BV
    Journal
    Thin Solid Films
    DOI
    10.1016/j.tsf.2012.07.052
    ae974a485f413a2113503eed53cd6c53
    10.1016/j.tsf.2012.07.052
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