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    Creep of parylene-C film

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    Type
    Conference Paper
    Authors
    Lin, Jeffrey Chun-Hui
    Deng, Peigang
    Lam, Gilbert
    Lu, Bo
    Lee, Yi-Kuen cc
    Tai, Yu-Chong
    KAUST Grant Number
    SA-C0040/UK-C0016
    Date
    2011-06
    Permanent link to this record
    http://hdl.handle.net/10754/597893
    
    Metadata
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    Abstract
    The glass transition temperature of as-deposited parylene-C is first measured to be 50°C with a ramping-temperature-dependent modulus experiment. The creep behavior of parylene-C film in the primary and secondary creep region is then investigated below and above this glass transition temperature using a dynamic mechanical analysis (DMA) machine Q800 from TA instruments at 8 different temperatures: 10, 25, 40, 60, 80, 100, 120 and 150°C. The Burger's model, which is the combined Maxwell model and Kelvin-Voigt model, fits well with our primary and secondary creep data. Accordingly, the results show that there's little or no creep below the glass transition temperature. Above the glass transition temperature, the primary creep and creep rate increases with the temperature, with a retardation time constant around 6 minutes. © 2011 IEEE.
    Citation
    Lin JC-H, Deng P, Lam G, Lu B, Lee Y-K, et al. (2011) Creep of parylene-C film. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference. Available: http://dx.doi.org/10.1109/transducers.2011.5969483.
    Sponsors
    This work is supported by Biomimetic MicroElectronic Systems (BMES) and partially supported by KAUST Award No. SA-C0040/UK-C0016. The authors would like to thank Trevor Roper's help in terms of sample preparation, machines' maintenance, and instrument's installation.
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Journal
    2011 16th International Solid-State Sensors, Actuators and Microsystems Conference
    DOI
    10.1109/transducers.2011.5969483
    ae974a485f413a2113503eed53cd6c53
    10.1109/transducers.2011.5969483
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