Corporate array of micromachined dipoles on silicon wafer for 60 GHz communication systems
KAUST Grant NumberUK-C0015 OUK
Permanent link to this recordhttp://hdl.handle.net/10754/597884
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AbstractIn this paper, an antenna array operating at 60 GHz and realized on 0.675 mm thick silicon substrate is presented. The array is constructed using four micromachined half-wavelength dipoles fed by a corporate feeding network. Isolation between the antenna array and its feeding network is achieved via a ground plane. This arrangement leads to maximizing the broadside radiation with relatively high front-to-back ratio. Simulations have been carried out using both HFSS and CST, which showed very good agreement. Results reveal that the proposed antenna array has good radiation characteristics, where the directivity, gain, and radiation efficiency are around 10.5 dBi, 9.5 dBi, and 79%, respectively. © 2013 IEEE.
CitationSallam MO, Soliman EA (2013) Corporate array of micromachined dipoles on silicon wafer for 60 GHz communication systems. 2013 International Workshop on Antenna Technology (iWAT). Available: http://dx.doi.org/10.1109/IWAT.2013.6518341.
SponsorsThis publication is based on work supported by award number: UK-C0015 OUK made by King Abdullah University of Science and Technology (KAUST).