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dc.contributor.authorHussain, Muhammad Mustafa
dc.contributor.authorRojas, Jhonathan Prieto
dc.date.accessioned2016-01-31T15:17:16Z
dc.date.available2016-01-31T15:17:16Z
dc.date.issued2014-08-28
dc.date.submitted2014-04-02
dc.identifier.urihttp://hdl.handle.net/10754/595312
dc.description.abstractA method for making a mechanically flexible silicon substrate is disclosed. In one embodiment, the method includes providing a silicon substrate. The method further includes forming a first etch stop layer in the silicon substrate and forming a second etch stop layer in the silicon substrate. The method also includes forming one or more trenches over the first etch stop layer and the second etch stop layer. The method further includes removing the silicon substrate between the first etch stop layer and the second etch stop layer.
dc.relation.urlhttp://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PG01&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.html&r=1&f=G&l=50&s1=%2220140239459%22.PGNR.&OS=DN/20140239459&RS=DN/20140239459
dc.relation.urlhttp://assignment.uspto.gov/#/search?adv=publNum:20140239459
dc.relation.urlhttp://www.google.com/patents/US20140239459
dc.relation.urlhttp://worldwide.espacenet.com/publicationDetails/biblio?CC=US&NR=2014239459A1&KC=A1&FT=D
dc.titleMethod For Producing Mechanically Flexible Silicon Substrate
dc.typePatent
dc.contributor.departmentElectrical Engineering Program
dc.description.statusGranted Patent
dc.contributor.assigneeKing Abdullah University of Science and Technology
dc.description.countryUnited States
dc.identifier.patentnumberUS9520293B2
dc.identifier.applicationnumberUS 20140239459 A1
refterms.dateFOA2018-06-13T14:10:30Z


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