Method For Producing Mechanically Flexible Silicon Substrate

Type
Patent

Patent Status
Granted Patent

Authors
Hussain, Muhammad Mustafa
Rojas, Jhonathan Prieto

Assignee
King Abdullah University of Science and Technology

KAUST Department
Electrical Engineering Program

Date
2014-08-28

Submitted Date
2014-04-02

Abstract
A method for making a mechanically flexible silicon substrate is disclosed. In one embodiment, the method includes providing a silicon substrate. The method further includes forming a first etch stop layer in the silicon substrate and forming a second etch stop layer in the silicon substrate. The method also includes forming one or more trenches over the first etch stop layer and the second etch stop layer. The method further includes removing the silicon substrate between the first etch stop layer and the second etch stop layer.

Patent Number
US9520293B2

Application Number
US 20140239459 A1

Additional Links
http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PG01&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.html&r=1&f=G&l=50&s1="20140239459".PGNR.&OS=DN/20140239459&RS=DN/20140239459
http://assignment.uspto.gov/#/search?adv=publNum:20140239459
http://www.google.com/patents/US20140239459
http://worldwide.espacenet.com/publicationDetails/biblio?CC=US&NR=2014239459A1&KC=A1&FT=D

Permanent link to this record