Patent StatusGranted Patent
KAUST DepartmentElectrical Engineering Program
Permanent link to this recordhttp://hdl.handle.net/10754/595312
MetadataShow full item record
AbstractA method for making a mechanically flexible silicon substrate is disclosed. In one embodiment, the method includes providing a silicon substrate. The method further includes forming a first etch stop layer in the silicon substrate and forming a second etch stop layer in the silicon substrate. The method also includes forming one or more trenches over the first etch stop layer and the second etch stop layer. The method further includes removing the silicon substrate between the first etch stop layer and the second etch stop layer.
Application NumberUS 20140239459 A1