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dc.contributor.authorLone, Saifullah
dc.contributor.authorZhang, Jiaming
dc.contributor.authorVakarelski, Ivan Uriev
dc.contributor.authorThoroddsen, Sigurdur T
dc.date.accessioned2016-01-28T07:14:02Z
dc.date.available2016-01-28T07:14:02Z
dc.date.issued2015-06-29
dc.identifier.urihttp://hdl.handle.net/10754/595126
dc.description.abstractWe exploited the combination of dry deposition of monolayer of 2D (two dimensional) templates, lift-up transfer of 2D template onto flat surfaces and evaporation lithography [1] to fabricate gold micro- and submicron size wire networks. The approach relies upon the defect free dry deposition of 2D monolayer of latex particles [2] on patterned silicon template and flat PDMS-substrate to create square centered and honey-comb wire networks respectively. The process is followed by lift-up transfer of 2D latex crystal on glass substrate. Subsequently, a small amount of AuNP-suspension is doped on top of the transferred crystal; the suspension is allowed to spread instantaneously and dried at low temperature. The liquid evaporates uniformly to the direction perpendicular to glass substrate. During evaporation, AuNPs are de-wetted along with the movement of liquid to self-assemble in-between the inter-particle spaces and therefore, giving rise to liquid-bridge networks which upon delayed evaporation, transforms into wire networks. The approach is used to fabricate both micro- and submicron wire-networks by simply changing the template dimensions. One of the prime motives behind this study is to down-scale the existing particle array template-based evaporation lithography process to fabricate connected gold wire networks at both micro- and submicron scale. Secondly, the idea of combining the patterned silicon wafer with lifted latex particle template creates an opportunity to clean and res-use the patterned wafer more often and thereby, saving fabrication time and resources. Finally, we illustrated the validity of this approach by creating an easy and high-speed approach to develop gold wire networks on a flexible substrate with a thin deposited adhesive. These advances will not only serve as a platform to scale up the production, but also demonstrated that the fabrication method can produce metallic wire networks of different scale and onto a variety of substrates.
dc.relation.urlhttp://afm2015.functionalmaterials.org/wp-content/uploads/2015/07/S2-Abs.pdf
dc.subjectDry Deposition
dc.subjectLift-up
dc.subjectDoping
dc.subjectEvaporation
dc.subjectSelf-Assembly
dc.subjectWires
dc.titleGold Wire-networks: Particle Array Guided Evaporation Lithograpy
dc.typePresentation
dc.contributor.departmentHigh-Speed Fluids Imaging Laboratory
dc.contributor.departmentMechanical Engineering Program
dc.contributor.departmentPhysical Science and Engineering (PSE) Division
dc.conference.date29 June – 3 July 2015
dc.conference.nameInternational Conference on Advances in Functional Materials (AFM 2015)
dc.conference.locationStony Brook University, NY State, USA
kaust.personLone, Saifullah
kaust.personZhang, Jiaming
kaust.personVakarelski, Ivan Uriev
kaust.personThoroddsen, Sigurdur T.


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