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    Gold Wire-networks: Particle Array Guided Evaporation Lithograpy

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    Type
    Presentation
    Authors
    Lone, Saifullah cc
    Zhang, Jiaming cc
    Vakarelski, Ivan Uriev cc
    Thoroddsen, Sigurdur T cc
    KAUST Department
    High-Speed Fluids Imaging Laboratory
    Mechanical Engineering Program
    Physical Science and Engineering (PSE) Division
    Date
    2015-06-29
    Permanent link to this record
    http://hdl.handle.net/10754/595126
    
    Metadata
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    Abstract
    We exploited the combination of dry deposition of monolayer of 2D (two dimensional) templates, lift-up transfer of 2D template onto flat surfaces and evaporation lithography [1] to fabricate gold micro- and submicron size wire networks. The approach relies upon the defect free dry deposition of 2D monolayer of latex particles [2] on patterned silicon template and flat PDMS-substrate to create square centered and honey-comb wire networks respectively. The process is followed by lift-up transfer of 2D latex crystal on glass substrate. Subsequently, a small amount of AuNP-suspension is doped on top of the transferred crystal; the suspension is allowed to spread instantaneously and dried at low temperature. The liquid evaporates uniformly to the direction perpendicular to glass substrate. During evaporation, AuNPs are de-wetted along with the movement of liquid to self-assemble in-between the inter-particle spaces and therefore, giving rise to liquid-bridge networks which upon delayed evaporation, transforms into wire networks. The approach is used to fabricate both micro- and submicron wire-networks by simply changing the template dimensions. One of the prime motives behind this study is to down-scale the existing particle array template-based evaporation lithography process to fabricate connected gold wire networks at both micro- and submicron scale. Secondly, the idea of combining the patterned silicon wafer with lifted latex particle template creates an opportunity to clean and res-use the patterned wafer more often and thereby, saving fabrication time and resources. Finally, we illustrated the validity of this approach by creating an easy and high-speed approach to develop gold wire networks on a flexible substrate with a thin deposited adhesive. These advances will not only serve as a platform to scale up the production, but also demonstrated that the fabrication method can produce metallic wire networks of different scale and onto a variety of substrates.
    Conference/Event name
    International Conference on Advances in Functional Materials (AFM 2015)
    Additional Links
    http://afm2015.functionalmaterials.org/wp-content/uploads/2015/07/S2-Abs.pdf
    Collections
    Physical Science and Engineering (PSE) Division; Mechanical Engineering Program; Presentations

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