Prediction of crack density and electrical resistance changes in indium tin oxide/polymer thin films under tensile loading
Type
ArticleKAUST Department
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) DivisionMechanical Engineering Program
Physical Science and Engineering (PSE) Division
Date
2014-06-11Online Publication Date
2014-06-11Print Publication Date
2015-05Permanent link to this record
http://hdl.handle.net/10754/594296
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We present unified predictions for the crack onset strain, evolution of crack density, and changes in electrical resistance in indium tin oxide/polymer thin films under tensile loading. We propose a damage mechanics model to quantify and predict such changes as an alternative to fracture mechanics formulations. Our predictions are obtained by assuming that there are no flaws at the onset of loading as opposed to the assumptions of fracture mechanics approaches. We calibrate the crack onset strain and the damage model based on experimental data reported in the literature. We predict crack density and changes in electrical resistance as a function of the damage induced in the films. We implement our model in the commercial finite element software ABAQUS using a user subroutine UMAT. We obtain fair to good agreement with experiments. © The Author(s) 2014 Reprints and permissions: sagepub.co.uk/journalsPermissions.nav.Citation
Mora A, Khan KA, El Sayed T (2014) Prediction of crack density and electrical resistance changes in indium tin oxide/polymer thin films under tensile loading. International Journal of Damage Mechanics 24: 546–561. Available: http://dx.doi.org/10.1177/1056789514539362.Sponsors
This work was fully funded by KAUST's research funds. We thank Prof. Gilles Lubineau and Mohamed A. Nasr Saleh from the COHMAS laboratory at KAUST for their support in providing us with microscope images showing crack evolution.Publisher
SAGE Publicationsae974a485f413a2113503eed53cd6c53
10.1177/1056789514539362