Prediction of crack density and electrical resistance changes in indium tin oxide/polymer thin films under tensile loading
KAUST DepartmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Mechanical Engineering Program
Physical Science and Engineering (PSE) Division
Online Publication Date2014-06-11
Print Publication Date2015-05
Permanent link to this recordhttp://hdl.handle.net/10754/594296
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AbstractWe present unified predictions for the crack onset strain, evolution of crack density, and changes in electrical resistance in indium tin oxide/polymer thin films under tensile loading. We propose a damage mechanics model to quantify and predict such changes as an alternative to fracture mechanics formulations. Our predictions are obtained by assuming that there are no flaws at the onset of loading as opposed to the assumptions of fracture mechanics approaches. We calibrate the crack onset strain and the damage model based on experimental data reported in the literature. We predict crack density and changes in electrical resistance as a function of the damage induced in the films. We implement our model in the commercial finite element software ABAQUS using a user subroutine UMAT. We obtain fair to good agreement with experiments. © The Author(s) 2014 Reprints and permissions: sagepub.co.uk/journalsPermissions.nav.
CitationMora A, Khan KA, El Sayed T (2014) Prediction of crack density and electrical resistance changes in indium tin oxide/polymer thin films under tensile loading. International Journal of Damage Mechanics 24: 546–561. Available: http://dx.doi.org/10.1177/1056789514539362.
SponsorsThis work was fully funded by KAUST's research funds. We thank Prof. Gilles Lubineau and Mohamed A. Nasr Saleh from the COHMAS laboratory at KAUST for their support in providing us with microscope images showing crack evolution.