Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels
AuthorsGhoneim, Mohamed T.
Fahad, Hossain M.
Hussain, Aftab M.
Rojas, Jhonathan Prieto
Sevilla, Galo T.
Lizardo, Ernesto B.
Hussain, Muhammad Mustafa
KAUST DepartmentIntegrated Nanotechnology Lab
Electrical Engineering Program
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Permanent link to this recordhttp://hdl.handle.net/10754/592510
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AbstractIn today’s digital world, complementary metal oxide semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their higher performance but with increased dynamic and off-state power consumption. Such trade-off has caused excessive heat generation which eventually drains the charge of battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used for heat management make the whole system bulky and less mobile. Here we show, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical “through silicon” micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads. We also show the effectiveness of this event in functional MOS field effect transistors (MOSFETs) with high-κ/metal gate stacks.
CitationEnhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels 2015, 5 (12):127115 AIP Advances