Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels
Type
ArticleAuthors
Ghoneim, Mohamed T.
Fahad, Hossain M.
Hussain, Aftab M.

Rojas, Jhonathan Prieto

Sevilla, Galo T.

Alfaraj, Nasir

Lizardo, Ernesto B.
Hussain, Muhammad Mustafa

KAUST Department
Integrated Nanotechnology LabElectrical Engineering Program
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Date
2015-12-11Online Publication Date
2015-12-11Print Publication Date
2015-12Permanent link to this record
http://hdl.handle.net/10754/592510
Metadata
Show full item recordAbstract
In today’s digital world, complementary metal oxide semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their higher performance but with increased dynamic and off-state power consumption. Such trade-off has caused excessive heat generation which eventually drains the charge of battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used for heat management make the whole system bulky and less mobile. Here we show, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical “through silicon” micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads. We also show the effectiveness of this event in functional MOS field effect transistors (MOSFETs) with high-κ/metal gate stacks.Citation
Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels 2015, 5 (12):127115 AIP AdvancesPublisher
AIP PublishingJournal
AIP Advancesae974a485f413a2113503eed53cd6c53
10.1063/1.4938101