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    Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels

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    1.4938101.pdf
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    Type
    Article
    Authors
    Ghoneim, Mohamed T. cc
    Fahad, Hossain M.
    Hussain, Aftab M. cc
    Rojas, Jhonathan Prieto cc
    Sevilla, Galo T. cc
    Alfaraj, Nasir cc
    Lizardo, Ernesto B.
    Hussain, Muhammad Mustafa cc
    KAUST Department
    Integrated Nanotechnology Lab
    Electrical Engineering Program
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Date
    2015-12-11
    Online Publication Date
    2015-12-11
    Print Publication Date
    2015-12
    Permanent link to this record
    http://hdl.handle.net/10754/592510
    
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    Abstract
    In today’s digital world, complementary metal oxide semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their higher performance but with increased dynamic and off-state power consumption. Such trade-off has caused excessive heat generation which eventually drains the charge of battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used for heat management make the whole system bulky and less mobile. Here we show, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical “through silicon” micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads. We also show the effectiveness of this event in functional MOS field effect transistors (MOSFETs) with high-κ/metal gate stacks.
    Citation
    Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels 2015, 5 (12):127115 AIP Advances
    Publisher
    AIP Publishing
    Journal
    AIP Advances
    DOI
    10.1063/1.4938101
    Additional Links
    http://scitation.aip.org/content/aip/journal/adva/5/12/10.1063/1.4938101
    ae974a485f413a2113503eed53cd6c53
    10.1063/1.4938101
    Scopus Count
    Collections
    Articles; Electrical and Computer Engineering Program; Integrated Nanotechnology Lab; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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