AuthorsGhoneim, Mohamed T.
Sevilla, Galo T.
Fahad, Hossain M.
Hussain, Muhammad Mustafa
KAUST DepartmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Integrated Nanotechnology Lab
Online Publication Date2015-08-12
Print Publication Date2015-06
Permanent link to this recordhttp://hdl.handle.net/10754/581769
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AbstractSummary form only given. We report out-of-plane strain effect on silicon based flexible FinFET, with sub 20 nm wide fins and hafnium silicate based high-κ gate dielectric. Since ultra-thin inorganic solid state substrates become flexible with reduced thickness, flexing induced strain does not enhance performance. However, detrimental effects arise as the devices are subject to various out-of-plane stresses (compressive and tensile) along the channel length.
CitationGhoneim, M. T., Alfaraj, N., Torres Sevilla, G. A., Fahad, H. M., & Hussain, M. M. (2015). Out-of-plane strain effect on silicon-based flexible FinFETs. 2015 73rd Annual Device Research Conference (DRC). doi:10.1109/drc.2015.7175572
Conference/Event name2015 73rd Annual Device Research Conference (DRC)