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dc.contributor.authorDiaz, Edwin Hernandez
dc.contributor.authorAlfano, Marco
dc.contributor.authorLubineau, Gilles
dc.contributor.authorButtner, Ulrich
dc.date.accessioned2015-11-05T05:43:10Z
dc.date.available2015-11-05T05:43:10Z
dc.date.issued2015-10-19
dc.identifier.citationImproving adhesion of copper/epoxy joints by pulsed laser ablation 2016, 64:23 International Journal of Adhesion and Adhesives
dc.identifier.issn01437496
dc.identifier.doi10.1016/j.ijadhadh.2015.10.003
dc.identifier.urihttp://hdl.handle.net/10754/581763
dc.description.abstractThe purpose of the present work is to analyze the effect of pulsed laser ablation on copper substrates (CuZn40) deployed for adhesive bonding. Surface pre-treatment was carried using an Yb-fiber laser beam. Treated surfaces were probed using Scanning Electron Microscopy (SEM) and X-Ray Photoelectron Spectroscopy (XPS). The mechanical performance of CuZn40/epoxy bonded joints was assessed using the T-peel test coupon. In order to resolve the mechanisms of failure and adhesive penetration within surface asperities induced by the laser treatment, fracture surfaces were surveyed using SEM. Finite element simulations, based on the use of the cohesive zone model of fracture, were carried out to evaluate the variation of bond toughness. Results indicated that the laser ablation process effectively modifies surface morphology and chemistry and enables enhanced mechanical interlocking and cohesive failure within the adhesive layer. Remarkable improvements of apparent peel energy and bond toughness were observed with respect to control samples with sanded substrates.
dc.language.isoen
dc.publisherElsevier BV
dc.relation.urlhttp://linkinghub.elsevier.com/retrieve/pii/S0143749615001566
dc.rightsNOTICE: this is the author’s version of a work that was accepted for publication in International Journal of Adhesion and Adhesives. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in International Journal of Adhesion and Adhesives, 19 October 2015. DOI: 10.1016/j.ijadhadh.2015.10.003
dc.subjectLaser ablation
dc.subjectCopper alloy
dc.subjectEpoxy
dc.subjectInterlocking
dc.titleImproving adhesion of copper/epoxy joints by pulsed laser ablation
dc.typeArticle
dc.contributor.departmentComposite and Heterogeneous Material Analysis and Simulation Laboratory (COHMAS)
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentMechanical Engineering Program
dc.contributor.departmentPhysical Science and Engineering (PSE) Division
dc.identifier.journalInternational Journal of Adhesion and Adhesives
dc.eprint.versionPost-print
dc.contributor.institutionDepartment of Mechanical, Energy and Management Engineering, University of Calabria, Via P. Bucci 44C, 87036 Rende (CS), Italy
dc.contributor.affiliationKing Abdullah University of Science and Technology (KAUST)
kaust.personHernandez Diaz, Edwin
kaust.personLubineau, Gilles
kaust.personButtner, Ulrich
refterms.dateFOA2017-10-19T00:00:00Z
dc.date.published-online2015-10-19
dc.date.published-print2016-01


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