• Login
    View Item 
    •   Home
    • Research
    • Articles
    • View Item
    •   Home
    • Research
    • Articles
    • View Item
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Browse

    All of KAUSTCommunitiesIssue DateSubmit DateThis CollectionIssue DateSubmit Date

    My Account

    Login

    Quick Links

    Open Access PolicyORCID LibguideTheses and Dissertations LibguideSubmit an Item

    Statistics

    Display statistics

    Improving adhesion of copper/epoxy joints by pulsed laser ablation

    • CSV
    • RefMan
    • EndNote
    • BibTex
    • RefWorks
    Thumbnail
    Name:
    manuscript_J1140_final.pdf
    Size:
    2.816Mb
    Format:
    PDF
    Description:
    Accepted Manuscript
    Download
    Type
    Article
    Authors
    Diaz, Edwin Hernandez cc
    Alfano, Marco cc
    Lubineau, Gilles cc
    Buttner, Ulrich
    KAUST Department
    Composite and Heterogeneous Material Analysis and Simulation Laboratory (COHMAS)
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Mechanical Engineering Program
    Physical Science and Engineering (PSE) Division
    Date
    2015-10-19
    Online Publication Date
    2015-10-19
    Print Publication Date
    2016-01
    Permanent link to this record
    http://hdl.handle.net/10754/581763
    
    Metadata
    Show full item record
    Abstract
    The purpose of the present work is to analyze the effect of pulsed laser ablation on copper substrates (CuZn40) deployed for adhesive bonding. Surface pre-treatment was carried using an Yb-fiber laser beam. Treated surfaces were probed using Scanning Electron Microscopy (SEM) and X-Ray Photoelectron Spectroscopy (XPS). The mechanical performance of CuZn40/epoxy bonded joints was assessed using the T-peel test coupon. In order to resolve the mechanisms of failure and adhesive penetration within surface asperities induced by the laser treatment, fracture surfaces were surveyed using SEM. Finite element simulations, based on the use of the cohesive zone model of fracture, were carried out to evaluate the variation of bond toughness. Results indicated that the laser ablation process effectively modifies surface morphology and chemistry and enables enhanced mechanical interlocking and cohesive failure within the adhesive layer. Remarkable improvements of apparent peel energy and bond toughness were observed with respect to control samples with sanded substrates.
    Citation
    Improving adhesion of copper/epoxy joints by pulsed laser ablation 2016, 64:23 International Journal of Adhesion and Adhesives
    Publisher
    Elsevier BV
    Journal
    International Journal of Adhesion and Adhesives
    DOI
    10.1016/j.ijadhadh.2015.10.003
    Additional Links
    http://linkinghub.elsevier.com/retrieve/pii/S0143749615001566
    ae974a485f413a2113503eed53cd6c53
    10.1016/j.ijadhadh.2015.10.003
    Scopus Count
    Collections
    Articles; Physical Science and Engineering (PSE) Division; Electrical and Computer Engineering Program; Mechanical Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

    entitlement

     
    DSpace software copyright © 2002-2022  DuraSpace
    Quick Guide | Contact Us | KAUST University Library
    Open Repository is a service hosted by 
    Atmire NV
     

    Export search results

    The export option will allow you to export the current search results of the entered query to a file. Different formats are available for download. To export the items, click on the button corresponding with the preferred download format.

    By default, clicking on the export buttons will result in a download of the allowed maximum amount of items. For anonymous users the allowed maximum amount is 50 search results.

    To select a subset of the search results, click "Selective Export" button and make a selection of the items you want to export. The amount of items that can be exported at once is similarly restricted as the full export.

    After making a selection, click one of the export format buttons. The amount of items that will be exported is indicated in the bubble next to export format.