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dc.contributor.authorArevalo, A.
dc.contributor.authorRawashdeh, E.
dc.contributor.authorFoulds, I. G.
dc.date.accessioned2015-10-28T13:35:32Z
dc.date.available2015-10-28T13:35:32Z
dc.date.issued2014-10-08
dc.identifier.urihttp://hdl.handle.net/10754/581359
dc.description.abstractThis paper reports the structural solid mechanic simulation of a MEMS out-of-plane platform that provides thermal and electrical isolation for a device built on it. When assemble, the platform lifted for approximately 400 μm above the substrate level. A mechanical stress analysis is then presented in order to evaluate the feasibility of building it using commonly used materials in MEMS. Our analysis showed that polymeric materials such as polyimide and SU8 may undergo a localized plastic deformation but are not likely to fail upon assembly. Polysilicon on the contrary, showed high failure probability.
dc.relation.urlhttps://www.comsol.com/paper/platform-isolation-using-out-of-plane-complaint-mechanisms-19569
dc.titlePlatform Isolation Using Out-of-Plane Complaint Mechanisms
dc.typeConference Paper
dc.typePresentation
dc.typePoster
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.identifier.journalProceedings of the 2014 COMSOL Conference in Boston
dc.conference.dateOctober 8-10, 2014
dc.conference.namethe 2014 COMSOL Conference
dc.conference.locationBoston, MA, USA
dc.eprint.versionPublisher's Version/PDF
dc.contributor.institutionSchool of Engineering, University of British Columbia - Okanagan, Vancouver, BC, Canada
refterms.dateFOA2018-06-13T11:06:46Z


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