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    Platform Isolation Using Out-of-Plane Complaint Mechanisms

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    conference paper
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    Type
    Conference Paper
    Presentation
    Poster
    Authors
    Arevalo, A.
    Rawashdeh, E.
    Foulds, I. G.
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Date
    2014-10-08
    Permanent link to this record
    http://hdl.handle.net/10754/581359
    
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    Abstract
    This paper reports the structural solid mechanic simulation of a MEMS out-of-plane platform that provides thermal and electrical isolation for a device built on it. When assemble, the platform lifted for approximately 400 μm above the substrate level. A mechanical stress analysis is then presented in order to evaluate the feasibility of building it using commonly used materials in MEMS. Our analysis showed that polymeric materials such as polyimide and SU8 may undergo a localized plastic deformation but are not likely to fail upon assembly. Polysilicon on the contrary, showed high failure probability.
    Journal
    Proceedings of the 2014 COMSOL Conference in Boston
    Conference/Event name
    the 2014 COMSOL Conference
    Additional Links
    https://www.comsol.com/paper/platform-isolation-using-out-of-plane-complaint-mechanisms-19569
    Collections
    Conference Papers; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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