A versatile multi-user polyimide surface micromachinning process for MEMS applications
Type
Conference PaperAuthors
Carreno, Armando Arpys Arevalo
Byas, E.
Conchouso Gonzalez, David

Castro, David

Ilyas, Saad

Foulds, Ian G.
KAUST Department
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) DivisionElectrical Engineering Program
Mechanical Engineering Program
Date
2015-04Permanent link to this record
http://hdl.handle.net/10754/577100
Metadata
Show full item recordAbstract
This paper reports a versatile multi-user micro-fabrication process for MEMS devices, the 'Polyimide MEMS Multi-User Process' (PiMMPs). The reported process uses polyimide as the structural material and three separate metallization layers that can be interconnected depending on the desired application. This process enables for the first time the development of out-of-plane compliant mechanisms that can be designed using six different physical principles for actuation and sensing on a wafer from a single fabrication run. These principles are electrostatic motion, thermal bimorph actuation, capacitive sensing, magnetic sensing, thermocouple-based sensing and radio frequency transmission and reception. © 2015 IEEE.Citation
Arevalo, A., Byas, E., Conchouso, D., Castro, D., Ilyas, S., & Foulds, I. G. (2015). A versatile multi-user polyimide surface micromachinning process for MEMS applications. 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems. doi:10.1109/nems.2015.7147492Conference/Event name
10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015ae974a485f413a2113503eed53cd6c53
10.1109/NEMS.2015.7147492