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    A versatile multi-user polyimide surface micromachinning process for MEMS applications

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    Type
    Conference Paper
    Authors
    Carreno, Armando Arpys Arevalo cc
    Byas, E.
    Conchouso Gonzalez, David cc
    Castro, David cc
    Ilyas, Saad cc
    Foulds, Ian G.
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Mechanical Engineering Program
    Date
    2015-04
    Permanent link to this record
    http://hdl.handle.net/10754/577100
    
    Metadata
    Show full item record
    Abstract
    This paper reports a versatile multi-user micro-fabrication process for MEMS devices, the 'Polyimide MEMS Multi-User Process' (PiMMPs). The reported process uses polyimide as the structural material and three separate metallization layers that can be interconnected depending on the desired application. This process enables for the first time the development of out-of-plane compliant mechanisms that can be designed using six different physical principles for actuation and sensing on a wafer from a single fabrication run. These principles are electrostatic motion, thermal bimorph actuation, capacitive sensing, magnetic sensing, thermocouple-based sensing and radio frequency transmission and reception. © 2015 IEEE.
    Citation
    Arevalo, A., Byas, E., Conchouso, D., Castro, D., Ilyas, S., & Foulds, I. G. (2015). A versatile multi-user polyimide surface micromachinning process for MEMS applications. 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems. doi:10.1109/nems.2015.7147492
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Journal
    10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
    Conference/Event name
    10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015
    DOI
    10.1109/NEMS.2015.7147492
    ae974a485f413a2113503eed53cd6c53
    10.1109/NEMS.2015.7147492
    Scopus Count
    Collections
    Conference Papers; Electrical and Computer Engineering Program; Mechanical Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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