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dc.contributor.authorNafe, Mahmoud
dc.contributor.authorSyed, Ahad
dc.contributor.authorShamim, Atif
dc.date.accessioned2015-09-01T11:47:56Z
dc.date.available2015-09-01T11:47:56Z
dc.date.issued2015-04-13
dc.identifier.urihttp://hdl.handle.net/10754/576153
dc.description.abstractThe bottleneck for realizing high efficiency System-on-Chip is integrating the antenna on the lossy silicon substrate. To shield the antenna from the silicon, a ground plane can be used. However, the ultra-thin oxide does not provide enough separation between the antenna and the ground plane. In this work, we demonstrate one of the highest reported gains to date for low profile 94 GHz on-chip dipole antenna while the ground plane is in the lowest metal in the oxide (M1). This is achieved by optimizing an Artificial Magnetic Conductor (AMC) structure midway the antenna and M1. The dipole antenna without the AMC has a gain of − 11 dBi while with the AMC structure a gain of + 4.8 dBi and hence achieving a gain enhancement of + 15.8 dB.
dc.publisherIEEE
dc.relation.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=7228539&contentType=Conference+Publications
dc.subjectmm-wave
dc.subjecton-chip antenna
dc.subjectSoC
dc.subjectartifical magnetic conductor (AMC) and High-Impedance-Surface (HiS)
dc.titleGain enhancement of low profile on-chip dipole antenna via Artificial Magnetic Conductor at 94 GHz
dc.typeConference Paper
dc.contributor.departmentElectrical Engineering Program
dc.identifier.journalAntennas and Propagation (EuCAP), 2015 9th European Conference on
dc.conference.date13-17 April 2015
dc.conference.name2015 9th European Conference on Antennas and Propagation (EuCAP)
dc.conference.locationLisbon, Portugal
dc.eprint.versionPublisher's Version/PDF
refterms.dateFOA2018-06-13T13:23:10Z


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