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dc.contributor.authorChen, Pai-Yen
dc.contributor.authorFarhat, Mohamed
dc.contributor.authorBagci, Hakan
dc.date.accessioned2015-08-24T08:34:58Z
dc.date.available2015-08-24T08:34:58Z
dc.date.issued2015-03-31
dc.identifier.issn0957-4484
dc.identifier.issn1361-6528
dc.identifier.doi10.1088/0957-4484/26/16/164002
dc.identifier.urihttp://hdl.handle.net/10754/575647
dc.description.abstractWe propose a compact, wideband terahertz and infrared absorber, comprising a patterned graphene sheet on a thin metal-backed dielectric slab. This graphene-based nanostructure can achieve a low or negative effective permeability, necessary for realizing the perfect absorption. The dual-reactive property found in both the plasmonic graphene sheet and the grounded highpermittivity slab introduces extra poles into the equivalent circuit model of the system, thereby resulting in a dual-band or broadband magnetic resonance that enhances the absorption bandwidth. More interestingly, the two-dimensional patterned graphene sheet significantly simplifies the design and fabrication processes for achieving resonant magnetic response, and allows the frequency-reconfigurable operation via electrostatic gating.
dc.description.sponsorshipPYC would like to thank the KAUST Winter Enrichment Program (WEP). This work was partially funded by King Abdulaziz City for Science and Technology's TIC (Technology Innovation Center) for Solid-state Lighting at KAUST.
dc.publisherIOP Publishing
dc.titleGraphene metascreen for designing compact infrared absorbers with enhanced bandwidth
dc.typeArticle
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentComputational Electromagnetics Laboratory
dc.identifier.journalNanotechnology
dc.contributor.institutionWayne State Univ, Dept Elect & Comp Engn, Detroit, MI 48202 USA
kaust.personBagci, Hakan
kaust.personFarhat, Mohamed
kaust.acknowledged.supportUnitTechnology Innovation Center
dc.date.published-online2015-03-31
dc.date.published-print2015-04-24


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