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dc.contributor.authorRojas, Jhonathan Prieto
dc.contributor.authorHussain, Aftab M.
dc.contributor.authorCarreno, Armando Arpys Arevalo
dc.contributor.authorFoulds, I. G.
dc.contributor.authorSevilla, Galo T.
dc.contributor.authorNassar, Joanna M.
dc.contributor.authorHussain, Muhammad Mustafa
dc.date.accessioned2015-08-11T10:08:34Z
dc.date.available2015-08-11T10:08:34Z
dc.date.issued2015-05-22
dc.identifier.citationRojas, Jhonathan P., Aftab M. Hussain, A. Arevalo, I. G. Foulds, Galo A. Torres Sevilla, Joanna M. Nassar, and Muhammad M. Hussain. "Transformational electronics are now reconfiguring." In SPIE Defense+ Security, pp. 946709-946709. International Society for Optics and Photonics, 2015
dc.identifier.doi10.1117/12.2176790
dc.identifier.urihttp://hdl.handle.net/10754/565816
dc.description.abstractCurrent developments on enhancing our smart living experience are leveraging the increased interest for novel systems that can be compatible with foldable, wrinkled, wavy and complex geometries and surfaces, and thus become truly ubiquitous and easy to deploy. Therefore, relying on innovative structural designs we have been able to reconfigure the physical form of various materials, to achieve remarkable mechanical flexibility and stretchability, which provides us with the perfect platform to develop enhanced electronic systems for application in entertainment, healthcare, fitness and wellness, military and manufacturing industry. Based on these novel structural designs we have developed a siliconbased network of hexagonal islands connected through double-spiral springs, forming an ultra-stretchable (~1000%) array for full compliance to highly asymmetric shapes and surfaces, as well as a serpentine design used to show an ultrastretchable (~800%) and flexible, spatially reconfigurable, mobile, metallic thin film copper (Cu)-based, body-integrated and non-invasive thermal heater with wireless controlling capability, reusability, heating-adaptability and affordability due to low-cost complementary metal oxide semiconductor (CMOS)-compatible integration. © (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
dc.language.isoen
dc.publisherSPIE-Intl Soc Optical Eng
dc.relation.urlhttp://proceedings.spiedigitallibrary.org/proceeding.aspx?doi=10.1117/12.2176790
dc.rightsArchived with thanks to Proceedings of SPIE
dc.titleTransformational electronics are now reconfiguring
dc.typeConference Paper
dc.contributor.departmentIntegrated Nanotechnology Lab
dc.contributor.departmentElectromechanical Microsystems & Polymer Integration Research Lab (EMPIRe)
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.identifier.journalMicro- and Nanotechnology Sensors, Systems, and Applications VII
dc.conference.date2015-04-20 to 2015-04-24
dc.conference.name2015 Micro- and Nanotechnology (MNT) Sensors, Systems, and Applications VII Conference
dc.conference.locationBaltimore, MD, USA
dc.eprint.versionPublisher's Version/PDF
dc.contributor.institutionSchool of Engineering, The University of British Columbia, Okanagan Campus, Kelowna, V1V 1V7 British Columbia, Canada
dc.contributor.affiliationKing Abdullah University of Science and Technology (KAUST)
kaust.personRojas, Jhonathan Prieto
kaust.personHussain, Aftab M.
kaust.personSevilla, Galo T.
kaust.personNassar, Joanna M.
kaust.personHussain, Muhammad Mustafa
kaust.personCarreno, Armando Arpys Arevalo
refterms.dateFOA2018-06-14T08:24:55Z


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