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    High performance flexible CMOS SOI FinFETs

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    Type
    Conference Paper
    Authors
    Fahad, Hossain M.
    Sevilla, Galo T. cc
    Ghoneim, Mohamed T. cc
    Hussain, Muhammad Mustafa cc
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Integrated Nanotechnology Lab
    Date
    2014-06
    Permanent link to this record
    http://hdl.handle.net/10754/564925
    
    Metadata
    Show full item record
    Abstract
    We demonstrate the first ever CMOS compatible soft etch back based high performance flexible CMOS SOI FinFETs. The move from planar to non-planar FinFETs has enabled continued scaling down to the 14 nm technology node. This has been possible due to the reduction in off-state leakage and reduced short channel effects on account of the superior electrostatic charge control of multiple gates. At the same time, flexible electronics is an exciting expansion opportunity for next generation electronics. However, a fully integrated low-cost system will need to maintain ultra-large-scale-integration density, high performance and reliability - same as today's traditional electronics. Up until recently, this field has been mainly dominated by very weak performance organic electronics enabled by low temperature processes, conducive to low melting point plastics. Now however, we show the world's highest performing flexible version of 3D FinFET CMOS using a state-of-the-art CMOS compatible fabrication technique for high performance ultra-mobile consumer applications with stylish design. © 2014 IEEE.
    Citation
    Fahad, H., Sevilla, G. T., Ghoneim, M., & Hussain, M. M. (2014). High performance flexible CMOS SOI FinFETs. 72nd Device Research Conference. doi:10.1109/drc.2014.6872382
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Journal
    72nd Device Research Conference
    Conference/Event name
    72nd Device Research Conference, DRC 2014
    ISBN
    9781479954056
    DOI
    10.1109/DRC.2014.6872382
    ae974a485f413a2113503eed53cd6c53
    10.1109/DRC.2014.6872382
    Scopus Count
    Collections
    Conference Papers; Electrical and Computer Engineering Program; Integrated Nanotechnology Lab; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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