SIW based multilayer transition and power divider in LTCC technology
KAUST DepartmentElectrical Engineering Program
Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Permanent link to this recordhttp://hdl.handle.net/10754/564754
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AbstractA multilayer transition and balanced power divider are presented for millimeter-wave system-on-package (SoP). These two components operate at Ka-band and exploit the substrate integrate waveguide (SIW) technology with its shielding characteristics and the Low-temperature co-fired ceramics (LTCC) technology for its high density integration. A coupling slot has been used to perform vertical integration, which can be easily optimized through its length. The measured input return loss within the bandwidth of interest (32 GHz-38 GHz) is less than -15 dB and -18 dB for the multilayer transition and the power divider, respectively. The lateral dimensions of a multilayer system, such as a feed network of an array, can be greatly reduced by employing these 3D slot-coupled components. © 2013 IEEE.
Conference/Event name2013 IEEE MTT-S International Microwave Symposium Digest, MTT 2013