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dc.contributor.authorArsalan, Muhammad
dc.contributor.authorOuda, Mahmoud H.
dc.contributor.authorMarnat, Loic
dc.contributor.authorAhmad, Talha Jamal
dc.contributor.authorShamim, Atif
dc.contributor.authorSalama, Khaled N.
dc.date.accessioned2015-08-04T07:14:03Z
dc.date.available2015-08-04T07:14:03Z
dc.date.issued2013-06
dc.identifier.citationArsalan, M., Ouda, M. H., Marnat, L., Ahmad, T. J., Shamim, A., & Salama, K. N. (2013). A 5.2GHz, 0.5mW RF powered wireless sensor with dual on-chip antennas for implantable intraocular pressure monitoring. 2013 IEEE MTT-S International Microwave Symposium Digest (MTT). doi:10.1109/mwsym.2013.6697639
dc.identifier.isbn9781467361767
dc.identifier.issn0149645X
dc.identifier.doi10.1109/MWSYM.2013.6697639
dc.identifier.urihttp://hdl.handle.net/10754/564730
dc.description.abstractFor the first time a single chip implantable wireless sensor system for Intraocular Pressure Monitoring (IOPM) is presented. This system-on-chip (SoC) is battery-free and harvests energy from incoming RF signals. The chip is self-contained and does not require external components or bond wires to function. This 1.4mm3 SoC has separate 2.4GHz-transmit and 5.2GHz-receive antennas, an energy harvesting module, a temperature sensor, a 7-bit TIQ Flash ADC, a 4-bit RFID, a power management and control unit, and a VCO transmitter. The chip is fabricated in a standard 6-metal 0.18μm CMOS process and is designed to work with a post-processed MEMS pressure sensor. It consumes 513μW of peak power and when implanted inside the eye, it is designed to communicate with an external reader using on-off keying (OOK). © 2013 IEEE.
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.subjectGlaucoma wireless CMOS sensor
dc.subjectIntraocular Pressure Monitoring (IOPM)
dc.subjectSystem on a Chip (SoC)
dc.titleA 5.2GHz, 0.5mW RF powered wireless sensor with dual on-chip antennas for implantable intraocular pressure monitoring
dc.typeConference Paper
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentIntegrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
dc.contributor.departmentSensors Lab
dc.identifier.journal2013 IEEE MTT-S International Microwave Symposium Digest (MTT)
dc.conference.date2 June 2013 through 7 June 2013
dc.conference.name2013 IEEE MTT-S International Microwave Symposium Digest, MTT 2013
dc.conference.locationSeattle, WA
kaust.personArsalan, Muhammad
kaust.personMarnat, Loic
kaust.personShamim, Atif
kaust.personSalama, Khaled N.
kaust.personOuda, Mahmoud H.
kaust.personAhmad, Talha Jamal


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