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dc.contributor.authorMcKerricher, Garret
dc.contributor.authorGonzález, Juan Carlos Cano
dc.contributor.authorShamim, Atif
dc.date.accessioned2015-08-04T07:14:00Z
dc.date.available2015-08-04T07:14:00Z
dc.date.issued2013-06
dc.identifier.isbn9781467361767
dc.identifier.issn0149645X
dc.identifier.doi10.1109/MWSYM.2013.6697784
dc.identifier.urihttp://hdl.handle.net/10754/564729
dc.description.abstractFor the first time we present a method to create all inkjet printed multilayer RF passive components including vias. Although there has been previous work on multilayer RF components, they are not fully inkjet printed and involve complicated processing techniques such as laser cutting, conductive epoxy, or reactive ion etching This work demonstrates a truly all inkjet printed solution with a novel dissolving method for vias realization. A major issue with inkjet printing is often surface roughness, however by processing these materials at low temperature surface roughness <20nm RMS has been obtained which allows for high quality components to be fabricated and allows for stacked multilayer designs. © 2013 IEEE.
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.subjectCapacitors
dc.subjectInductors
dc.subjectInkjet printing
dc.subjectMultilayer
dc.subjectPoly 4 (vinyl phenol)
dc.subjectVias
dc.titleAll inkjet printed 3D microwave capacitors and inductors with vias
dc.typeConference Paper
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentIntegrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.identifier.journal2013 IEEE MTT-S International Microwave Symposium Digest (MTT)
dc.conference.date2 June 2013 through 7 June 2013
dc.conference.name2013 IEEE MTT-S International Microwave Symposium Digest, MTT 2013
dc.conference.locationSeattle, WA
kaust.personShamim, Atif
kaust.personMcKerricher, Garret
kaust.personGonzález, Juan Carlos Cano


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