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    Surface tension-induced high aspect-ratio PDMS micropillars with concave and convex lens tips

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    Type
    Conference Paper
    Authors
    Li, Huawei
    Fan, Yiqiang
    Yi, Ying
    Foulds, Ian G.
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electromechanical Microsystems & Polymer Integration Research Lab (EMPIRe)
    Electrical Engineering Program
    Date
    2013-04
    Permanent link to this record
    http://hdl.handle.net/10754/564703
    
    Metadata
    Show full item record
    Abstract
    This paper reports a novel method for the fabrication of 3-dimensional (3D) Polydimethylsiloxane (PDMS) micropillars with concave and convex lens tips in a one-step molding process, using a CO2 laser-machined Poly(methyl methacrylate) (PMMA) mold with through holes. The PDMS micropillars are 4 mm high and have an aspect ratio of 251. The micropillars are formed by capillary force drawing up PDMS into the through hole mold. The concave and convex lens tips of the PDMS cylindrical micropillars are induced by surface tension and are controllable by changing the surface wetting properties of the through holes in the PMMA mold. This technique eliminates the requirements of expensive and complicated facilities to prepare a 3D mold, and it provides a simple and rapid method to fabricate 3D PDMS micropillars with controllable dimensions and tip shapes. © 2013 IEEE.
    Citation
    Huawei Li, Yiqiang Fan, Ying Yi, & Foulds, I. G. (2013). Surface tension-induced high aspect-ratio PDMS micropillars with concave and convex lens tips. The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems. doi:10.1109/nems.2013.6559711
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Journal
    The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems
    Conference/Event name
    8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
    ISBN
    9781467363525
    DOI
    10.1109/NEMS.2013.6559711
    ae974a485f413a2113503eed53cd6c53
    10.1109/NEMS.2013.6559711
    Scopus Count
    Collections
    Conference Papers; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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