Mechanically flexible optically transparent porous mono-crystalline silicon substrate

Rojas, Jhonathan Prieto; Syed, Ahad A.; Hussain, Muhammad Mustafa

Mechanically flexible optically transparent porous mono-crystalline silicon substrate

Type

Conference Paper

Authors

Rojas, Jhonathan Prieto

Syed, Ahad A.
Hussain, Muhammad Mustafa

KAUST Department

Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Integrated Nanotechnology Lab
Physical Science and Engineering (PSE) Division

Date

2012-01

Abstract

For the first time, we present a simple process to fabricate a thin (≥5μm), mechanically flexible, optically transparent, porous mono-crystalline silicon substrate. Relying only on reactive ion etching steps, we are able to controllably peel off a thin layer of the original substrate. This scheme is cost favorable as it uses a low-cost silicon <100> wafer and furthermore it has the potential for recycling the remaining part of the wafer that otherwise would be lost and wasted during conventional back-grinding process. Due to its porosity, it shows see-through transparency and potential for flexible membrane applications, neural probing and such. Our process can offer flexible, transparent silicon from post high-thermal budget processed device wafer to retain the high performance electronics on flexible substrates. © 2012 IEEE.

Citation

Rojas, J. P., Syed, A., & Hussain, M. M. (2012). Mechanically flexible optically transparent porous mono-crystalline silicon substrate. 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS). doi:10.1109/memsys.2012.6170146