Type
Conference PaperAuthors
Abutarboush, HattanTawfik, Hani H.
Soliman, Ezzeldin A.
Sallam, Mai O.
Shamim, Atif

Sedky, Sherif M.
KAUST Department
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) DivisionElectrical Engineering Program
Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Physical Science and Engineering (PSE) Division
Date
2011-11Permanent link to this record
http://hdl.handle.net/10754/564448
Metadata
Show full item recordAbstract
A cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna's reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations. © 2011 IEEE.Citation
Abutarboush, H. F., Tawfik, H. H., Soliman, E. A., Sallam, M. O., Shamim, A., & Sedky, S. M. (2011). Effects of wafer-level packaging on millimetre-wave antennas. 2011 Loughborough Antennas & Propagation Conference. doi:10.1109/lapc.2011.6113964Conference/Event name
7th Loughborough Antennas and Propagation Conference, LAPC 2011ISBN
9781457710155ae974a485f413a2113503eed53cd6c53
10.1109/LAPC.2011.6113964