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    Effects of wafer-level packaging on millimetre-wave antennas

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    Type
    Conference Paper
    Authors
    Abutarboush, Hattan
    Tawfik, Hani H.
    Soliman, Ezzeldin A.
    Sallam, Mai O.
    Shamim, Atif cc
    Sedky, Sherif M.
    KAUST Department
    Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
    Electrical Engineering Program
    Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
    Physical Science and Engineering (PSE) Division
    Date
    2011-11
    Permanent link to this record
    http://hdl.handle.net/10754/564448
    
    Metadata
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    Abstract
    A cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna's reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations. © 2011 IEEE.
    Citation
    Abutarboush, H. F., Tawfik, H. H., Soliman, E. A., Sallam, M. O., Shamim, A., & Sedky, S. M. (2011). Effects of wafer-level packaging on millimetre-wave antennas. 2011 Loughborough Antennas & Propagation Conference. doi:10.1109/lapc.2011.6113964
    Publisher
    Institute of Electrical and Electronics Engineers (IEEE)
    Journal
    2011 Loughborough Antennas & Propagation Conference
    Conference/Event name
    7th Loughborough Antennas and Propagation Conference, LAPC 2011
    ISBN
    9781457710155
    DOI
    10.1109/LAPC.2011.6113964
    ae974a485f413a2113503eed53cd6c53
    10.1109/LAPC.2011.6113964
    Scopus Count
    Collections
    Conference Papers; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Physical Science and Engineering (PSE) Division; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division

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