Tawfik, Hani H.
Soliman, Ezzeldin A.
Sallam, Mai O.
Sedky, Sherif M.
KAUST DepartmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Physical Science and Engineering (PSE) Division
Permanent link to this recordhttp://hdl.handle.net/10754/564448
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AbstractA cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna's reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations. © 2011 IEEE.
CitationAbutarboush, H. F., Tawfik, H. H., Soliman, E. A., Sallam, M. O., Shamim, A., & Sedky, S. M. (2011). Effects of wafer-level packaging on millimetre-wave antennas. 2011 Loughborough Antennas & Propagation Conference. doi:10.1109/lapc.2011.6113964
Conference/Event name7th Loughborough Antennas and Propagation Conference, LAPC 2011