Effects of wafer-level packaging on millimetre-wave antennas

Type
Conference Paper
Authors
Abutarboush, Hattan
Tawfik, Hani H.
Soliman, Ezzeldin A.
Sallam, Mai O.
Shamim, Atif cc
Sedky, Sherif M.
KAUST Department
Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
Physical Science and Engineering (PSE) Division
Date
2011-11
Permanent link to this record
http://hdl.handle.net/10754/564448

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Abstract
A cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna's reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations. © 2011 IEEE.
Citation
Abutarboush, H. F., Tawfik, H. H., Soliman, E. A., Sallam, M. O., Shamim, A., & Sedky, S. M. (2011). Effects of wafer-level packaging on millimetre-wave antennas. 2011 Loughborough Antennas & Propagation Conference. doi:10.1109/lapc.2011.6113964
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Journal
2011 Loughborough Antennas & Propagation Conference
Conference/Event name
7th Loughborough Antennas and Propagation Conference, LAPC 2011
ISBN
9781457710155
DOI
10.1109/LAPC.2011.6113964
Collections
Conference Papers; Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab; Physical Science and Engineering (PSE) Division; Electrical and Computer Engineering Program; Computer, Electrical and Mathematical Science and Engineering (CEMSE) Division