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    Thin film transistors for flexible electronics: Contacts, dielectrics and semiconductors

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    Type
    Article
    Authors
    Quevedo-López, Manuel Angel Quevedo
    Wondmagegn, Wudyalew T.
    Alshareef, Husam N. cc
    Ramírez-Bon, Rafael
    Gnade, Bruce E.
    KAUST Department
    Functional Nanomaterials and Devices Research Group
    Material Science and Engineering Program
    Physical Science and Engineering (PSE) Division
    Date
    2011-06-01
    Permanent link to this record
    http://hdl.handle.net/10754/564392
    
    Metadata
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    Abstract
    The development of low temperature, thin film transistor processes that have enabled flexible displays also present opportunities for flexible electronics and flexible integrated systems. Of particular interest are possible applications in flexible sensor systems for unattended ground sensors, smart medical bandages, electronic ID tags for geo-location, conformal antennas, radiation detectors, etc. In this paper, we review the impact of gate dielectrics, contacts and semiconductor materials on thin film transistors for flexible electronics applications. We present our recent results to fully integrate hybrid complementary metal oxide semiconductors comprising inorganic and organic-based materials. In particular, we demonstrate novel gate dielectric stacks and semiconducting materials. The impact of source and drain contacts on device performance is also discussed. Copyright © 2011 American Scientific Publishers.
    Citation
    Quevedo-Lopez, M. A., Wondmagegn, W. T., Alshareef, H. N., Ramirez-Bon, R., & Gnade, B. E. (2011). Thin Film Transistors for Flexible Electronics: Contacts, Dielectrics and Semiconductors. Journal of Nanoscience and Nanotechnology, 11(6), 5532–5538. doi:10.1166/jnn.2011.3425
    Publisher
    American Scientific Publishers
    Journal
    Journal of Nanoscience and Nanotechnology
    DOI
    10.1166/jnn.2011.3425
    PubMed ID
    21770215
    ae974a485f413a2113503eed53cd6c53
    10.1166/jnn.2011.3425
    Scopus Count
    Collections
    Articles; Physical Science and Engineering (PSE) Division; Material Science and Engineering Program

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