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dc.contributor.authorDadgour, Hamed F.
dc.contributor.authorHussain, Muhammad Mustafa
dc.contributor.authorCassell, Alan M.
dc.contributor.authorSingh, Navab R.
dc.contributor.authorBanerjee, Kaustav
dc.date.accessioned2015-08-04T06:25:08Z
dc.date.available2015-08-04T06:25:08Z
dc.date.issued2011-04
dc.identifier.isbn9781424491117
dc.identifier.issn15417026
dc.identifier.doi10.1109/IRPS.2011.5784489
dc.identifier.urihttp://hdl.handle.net/10754/564367
dc.description.abstractNano-electro-mechanical switches (NEMS) offer new possibilities for the design of ultra energy-efficient systems; however, thus far, all the fabricated NEMS devices require high supply voltages that limit their applicability for logic designs. Therefore, research is being conducted to lower the operating voltages by scaling down the physical dimensions of these devices. However, the impact of device scaling on the electrical and mechanical properties of metal contacts in NEMS devices has not been thoroughly investigated in the literature. Such a study is essential because metal contacts play a critical role in determining the overall performance and reliability of NEMS. Therefore, the comprehensive analytical study presented in this paper highlights the performance and reliability degradations of such metal contacts caused by scaling. The proposed modeling environment accurately takes into account the impact of roughness of contact surfaces, elastic/plastic deformation of contacting asperities, and various inter-molecular forces between mating surfaces (such as Van der Waals and capillary forces). The modeling results are validated and calibrated using available measurement data. This scaling analysis indicates that the key contact properties of gold contacts (resistance, stiction and wear-out) deteriorate "exponentially" with scaling. Simulation results demonstrate that reliable (stiction-free) operation of very small contact areas (≈ 6nm x 6nm) will be a daunting task due to the existence of strong surface forces. Hence, contact degradation is identified as a major problem to the scaling of NEMS transistors. © 2011 IEEE.
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.subjectContact Degradation
dc.subjectContact Reliability
dc.subjectContact Resistance
dc.subjectDigital Circuits
dc.subjectNano-electro-mechanical Switches (NEMS)
dc.subjectProcess Variations
dc.subjectScaling Analysis
dc.subjectStiction
dc.subjectWear and Fatigue
dc.titleImpact of scaling on the performance and reliability degradation of metal-contacts in NEMS devices
dc.typeConference Paper
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentIntegrated Nanotechnology Lab
dc.contributor.departmentPhysical Science and Engineering (PSE) Division
dc.identifier.journal2011 International Reliability Physics Symposium
dc.conference.date10 April 2011 through 14 April 2011
dc.conference.name49th International Reliability Physics Symposium, IRPS 2011
dc.conference.locationMonterey, CA
dc.contributor.institutionDepartment of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93106, United States
dc.contributor.institutionNASA Ames Research Center, Moffett Field, CA 94035, United States
dc.contributor.institutionInstitute of Microelectronics, A STAR, Singapore, 117685, Singapore
kaust.personHussain, Muhammad Mustafa


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