Show simple item record

dc.contributor.authorAl Rowais, Hommood
dc.contributor.authorLi, Bodong
dc.contributor.authorLiang, Cai
dc.contributor.authorGreen, Scott Ryan
dc.contributor.authorGianchandani, Yogesh B.
dc.contributor.authorKosel, Jürgen
dc.date.accessioned2015-08-04T06:23:49Z
dc.date.available2015-08-04T06:23:49Z
dc.date.issued2011-04-06
dc.identifier.citationAl Rowais, H., Li, B., Liang, C., Green, S., Gianchandani, Y., & Kosel, J. (2011). Development of a passive and remote magnetic microsensor with thin-film giant magnetoimpedance element and surface acoustic wave transponder. Journal of Applied Physics, 109(7), 07E524. doi:10.1063/1.3562041
dc.identifier.issn00218979
dc.identifier.doi10.1063/1.3562041
dc.identifier.urihttp://hdl.handle.net/10754/564327
dc.description.abstractThis paper presents the development of a wireless magnetic field sensor consisting of a three-layer thin-film giant magnetoimpedance sensor and a surface acoustic wave device on one substrate. The goal of this integration is a passive and remotely interrogated sensor that can be easily mass fabricated using standard microfabrication tools. The design parameters, fabrication process, and a model of the integrated sensor are presented together with experimental results of the sensor. © 2011 American Institute of Physics.
dc.description.sponsorshipThis work was performed in part at the Lurie Nanofabrication Facility at the University of Michigan, a member of the National Nanotechnology Infrastructure Network, which is supported in part by the National Science Foundation.
dc.publisherAIP Publishing
dc.titleDevelopment of a passive and remote magnetic microsensor with thin-film giant magnetoimpedance element and surface acoustic wave transponder
dc.typeArticle
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.contributor.departmentMechanical Engineering Program
dc.contributor.departmentPhysical Science and Engineering (PSE) Division
dc.contributor.departmentSensing, Magnetism and Microsystems Lab
dc.identifier.journalJournal of Applied Physics
dc.contributor.institutionDepartment of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI 48109, United States
kaust.personLi, Bodong
kaust.personLiang, Cai
kaust.personKosel, Jürgen
kaust.personAl Rowais, Hommood
dc.date.published-online2011-04-06
dc.date.published-print2011-04


This item appears in the following Collection(s)

Show simple item record