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dc.contributor.authorZia, Asif Iqbal
dc.contributor.authorMukhopadhyay, Subhas Chandra
dc.contributor.authorYu, Paklam
dc.contributor.authorAl-Bahadly, Ibrahim H.
dc.contributor.authorGooneratne, Chinthaka Pasan
dc.contributor.authorKosel, Jürgen
dc.date.accessioned2015-08-03T12:35:20Z
dc.date.available2015-08-03T12:35:20Z
dc.date.issued2015-06
dc.identifier.issn1530437X
dc.identifier.doi10.1109/JSEN.2014.2355224
dc.identifier.urihttp://hdl.handle.net/10754/564179
dc.description.abstractThe surface roughness of thin-film gold electrodes induces instability in impedance spectroscopy measurements of capacitive interdigital printable sensors. Post-fabrication thermodynamic annealing was carried out at temperatures ranging from 30 °C to 210 °C in a vacuum oven and the variation in surface morphology of thin-film gold electrodes was observed by scanning electron microscopy. Impedance spectra obtained at different temperatures were translated into equivalent circuit models by applying complex nonlinear least square curve-fitting algorithm. Principal component analysis was applied to deduce the classification of the parameters affected due to the annealing process and to evaluate the performance stability using mathematical model. Physics of the thermodynamic annealing was discussed based on the surface activation energies. The post anneal testing of the sensors validated the achieved stability in impedance measurement. © 2001-2012 IEEE.
dc.description.sponsorshipThis work was supported in part by the Higher Education Commission, Lahore, Pakistan, in part by the School of Engineering and Advanced Technology, Massey University, Palmerston North, New Zealand, and in part by the COMSATS University of Science and Technology, Islamabad, Pakistan. The associate editor coordinating the review of this paper and approving it for publication was Dr. Ravinder S. Dahiya.
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.titlePost annealing performance evaluation of printable interdigital capacitive sensors by principal component analysis
dc.typeArticle
dc.contributor.departmentSensing, Magnetism and Microsystems Lab
dc.contributor.departmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
dc.contributor.departmentElectrical Engineering Program
dc.identifier.journalIEEE Sensors Journal
dc.contributor.institutionCOMSATS Institute of Information TechnologyIslamabad, Pakistan
dc.contributor.institutionSchool of Engineering and Advanced Technology, Massey UniversityPalmerston North, New Zealand
kaust.personGooneratne, Chinthaka Pasan
kaust.personKosel, Jürgen


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