Post annealing performance evaluation of printable interdigital capacitive sensors by principal component analysis
AuthorsZia, Asif Iqbal
Mukhopadhyay, Subhas Chandra
Al-Bahadly, Ibrahim H.
Gooneratne, Chinthaka Pasan
KAUST DepartmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Electrical Engineering Program
Physical Science and Engineering (PSE) Division
Sensing, Magnetism and Microsystems Lab
Permanent link to this recordhttp://hdl.handle.net/10754/564179
MetadataShow full item record
AbstractThe surface roughness of thin-film gold electrodes induces instability in impedance spectroscopy measurements of capacitive interdigital printable sensors. Post-fabrication thermodynamic annealing was carried out at temperatures ranging from 30 °C to 210 °C in a vacuum oven and the variation in surface morphology of thin-film gold electrodes was observed by scanning electron microscopy. Impedance spectra obtained at different temperatures were translated into equivalent circuit models by applying complex nonlinear least square curve-fitting algorithm. Principal component analysis was applied to deduce the classification of the parameters affected due to the annealing process and to evaluate the performance stability using mathematical model. Physics of the thermodynamic annealing was discussed based on the surface activation energies. The post anneal testing of the sensors validated the achieved stability in impedance measurement. © 2001-2012 IEEE.
CitationZia, A. I., Mukhopadhyay, S. C., Yu, P. L., Al-Bahadly, I. H., Gooneratne, C. P., & Kosel, J. (2015). Post Annealing Performance Evaluation of Printable Interdigital Capacitive Sensors by Principal Component Analysis. IEEE Sensors Journal, 15(6), 3110–3118. doi:10.1109/jsen.2014.2355224
SponsorsThis work was supported in part by the Higher Education Commission, Lahore, Pakistan, in part by the School of Engineering and Advanced Technology, Massey University, Palmerston North, New Zealand, and in part by the COMSATS University of Science and Technology, Islamabad, Pakistan. The associate editor coordinating the review of this paper and approving it for publication was Dr. Ravinder S. Dahiya.
JournalIEEE Sensors Journal