Ultrastretchable and flexible copper interconnect-based smart patch for adaptive thermotherapy
AuthorsHussain, Aftab M.
Lizardo, Ernesto B.
Sevilla, Galo T.
Nassar, Joanna M.
Hussain, Muhammad Mustafa
KAUST DepartmentComputer, Electrical and Mathematical Sciences and Engineering (CEMSE) Division
Integrated Nanotechnology Lab
Electrical Engineering Program
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AbstractUnprecedented 800% stretchable, non-polymeric, widely used, low-cost, naturally rigid, metallic thin-film copper (Cu)-based flexible and non-invasive, spatially tunable, mobile thermal patch with wireless controllability, adaptability (tunes the amount of heat based on the temperature of the swollen portion), reusability, and affordability due to low-cost complementary metal oxide semiconductor (CMOS) compatible integration. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
SponsorsThe authors acknowledge the financial support under KAUST Office of Competitive Research Funds CRG-1 Award (CRG-1-2012-HUS-008) for this work. The authors thank KAUST Microfluidics Lab, Prof. Jurgen Kosel and Dr. Ulrich Buttner for the thermal imaging system. The authors appreciate the useful discussions with Dr. Hossain M. Fahad and Dr. Jhonathan P. Rojas. The authors also thank Ms. Caitlin Clark for reviewing the literature of this paper. M.M.H. conceived the idea and directed the experiment. A.M.H. carried out the experiment. E.B.L., G.A.T.S., and J.M.N. provided experimental support. A.M.H. and M.M.H. analyzed the data and wrote the paper. All authors reviewed the paper.
JournalAdvanced Healthcare Materials